Photovoltaic devices including copper indium gallium selenide
View Patent ↗A copper indium gallium selenide photovoltaic cell can include a substrate having a transparent conductive oxide layer. The copper indium gallium selenide can be deposited using sputtering and vapor transport deposition.
1. A method of manufacturing a photovoltaic device comprising:
sequentially forming a plurality of material layers over a substrate by:
depositing by sputtering a first layer including copper, indium and gallium over the substrate;
depositing by vapor transport deposition a selenium layer over and in direct contact with the first layer including copper, indium and gallium to form a selenium layer directly over the first layer including copper, indium, and gallium;
depositing by sputtering a second layer including copper, indium and gallium over and in direct contact with the selenium layer directly over the first layer including copper, indium and gallium; and
depositing by vapor transport deposition a selenium layer over and in direct contact with the second layer including copper, indium and gallium to form a second selenium layer directly over the second layer including copper, indium and gallium.
2. The method of claim 1 , wherein the substrate comprises glass.
3. The method of claim 1 , further comprising:
depositing a transparent conductive layer over the substrate prior to the sequentially forming of a plurality of material layers.
4. The method of claim 3 , wherein the transparent conductive layer is a transparent conductive oxide layer.
5. The method of claim 4 , wherein the transparent conductive oxide layer is indium tin oxide.
6. The method of claim 1 , wherein the sequentially forming of a plurality of material layers includes forming at least 4 pairs of a selenium layer directly over a layer including copper, indium, and gallium, wherein each pair of layers is formed over and in direct contact with a respective pair of a selenium layer formed directly over a layer including copper, indium, and gallium.
7. The method of claim 1 , wherein the sequentially forming of a plurality of material layers includes forming at least 9 pairs of a selenium layer directly over a layer including copper, indium, and gallium, wherein each pair of layers is formed over and in direct contact with a respective pair of a selenium layer formed directly over a layer including copper, indium, and gallium.
8. The method of claim 1 , further comprising:
depositing a plurality of additional layers including copper, indium, and gallium over the substrate; and
depositing selenium over and in direct contact with each of the plurality of additional layers.
9. A method of manufacturing a photovoltaic device comprising:
depositing by sputtering a first layer including copper, indium and gallium over a substrate;
combining a carrier gas and selenium;
heating the carrier gas and selenium combination to form a heating vapor;
passing the heated vapor through a permeable membrane;
depositing a selenium layer from the vapor over and in direct contact with the first layer including copper, indium and gallium;
depositing by sputtering a second layer including copper, indium and gallium over and in direct contact with the selenium layer directly over the first layer including copper, indium and gallium; and
depositing a selenium layer over and in direct contact with the second layer including copper, indium and gallium.
10. The method of claim 9 , further comprising depositing a transparent conductive layer over the substrate prior to the depositing the first layer including copper, indium and gallium.
11. The method of claim 10 , wherein the transparent conductive layer is a transparent conductive oxide layer.
12. The method of claim 11 , wherein the transparent conductive oxide layer is indium tin oxide.
13. A method of manufacturing a photovoltaic device comprising:
depositing by sputtering a first layer including copper, indium and gallium over a substrate; and
depositing by vapor transport deposition a selenium layer over and in direct contact with the first layer including copper, indium and gallium to form a first selenium layer directly over the first layer including copper, indium and gallium,
wherein the first layer including copper, indium and gallium is no more than about 0.1 micron thick;
depositing by sputtering a second layer including copper, indium and gallium over and in direct contact with the first selenium layer directly over the first layer including copper, indium and gallium, the second layer being no more than about 0.1 micron thick; and
depositing by vapor transport deposition a second selenium layer over and in direct contact with the second layer including copper, indium and gallium.
14. The method of claim 13 , wherein deposition of selenium comprising:
combining a carrier gas and selenium;
heating the carrier gas and selenium combination to form a heated vapor;
passing the heated vapor through a permeable membrane, and
depositing the selenium from the vapor over and in direct contact with the first and second layers including copper, indium and gallium.
15. The method of claim 13 , further comprising:
depositing a plurality of additional layers including copper, indium, and gallium over the substrate; and
depositing selenium over and in direct contact with each of the plurality of additional layers.