Truncated pyramid structures for see-through solar cells
The present disclosure presents a partially-transparent (see-through) three-dimensional thin film solar cell (3-D TFSC) substrate. The substrate includes a plurality of unit cells. Each unit cell structure has the shape of a truncated pyramid, and its parameters may be varied to allow a desired portion of sunlight to pass through.
1. A method for making a three-dimensional thin film solar cell, comprising:
patterning a reusable crystalline silicon template with a periodic array of hexagonal pyramidal cavities according to a wet chemical etching process, said reusable crystalline silicon template having dimensions of approximately 200×200 millimeters;
chemically cleaning said reusable crystalline silicon template;
forming a sacrificial porous silicon release layer comprising at least two different porosity values on a surface of said reusable crystalline silicon template, said porous silicon release layer comprising:
a top layer having a porosity in the range of 20% to 40%; and
a bottom layer having a porosity in the range of 40% to 80%;
depositing a doped crystalline silicon film onto said sacrificial porous silicon release layer, said doped silicon film being substantially conformal to said reusable crystalline silicon template and having a thickness in the range of 2 to 50 microns;
etching said sacrificial porous silicon release layer;
detaching and removing said doped silicon film from said reusable crystalline silicon template; and
removing a plurality of tips from said doped silicon film by:
depositing a hard masking thin layer having a thickness in the range of 0.05 to 0.5 microns on said doped silicon film;
patterning said hard masking thin layer according to a self-aligned selective chemical etching process, thereby creating exposed crystalline silicon regions not covered and protected by said hard masking layer; and
performing a selective silicon etching process to selectively etch away said regions not covered by said hard masking layer, thereby creating an array of see-through holes in said doped silicon film.