IP Library Granted Patent US 8,217,840
Granted Patent B2
US 8,217,840 · App. 12/627,014 · Granted Jul 10, 2012

Dual-band antenna assembly

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Quick Facts
Patent No.
US 8,217,840
App. No.
12/627,014
Granted
Jul 10, 2012
Kind
B2
Abstract

A dual-band antenna assembly is positioned on a substrate, and includes an insulation body, a plane antenna and a microstrip antenna. The insulation body includes a plane surface paralleled to the substrate, and a side surface perpendicularly extending from edges of the plane surface to the substrate. The plane antenna includes a first feed portion and a first radiator. The first feed portion passes through the substrate to the plane surface of the insulation body. The first radiator is substantially positioned on a center of the plane surface of the insulation body, and electrically connected to the first feed portion. The microstrip antenna includes a second feed portion and a second radiator. The second radiator is a microstrip, electrically connected to the second feed portion and positioned on the side surface of the insulation body.

Claims (16)

1. A dual-band antenna assembly, positioned on a substrate, the dual-band antenna comprising:

an insulation body, positioned on the substrate, and comprising a plane surface parallel to the substrate, and a side surface perpendicularly extending from edges of the plane surface to the substrate;

a plane antenna, comprising:

a first feed portion, passing from the substrate through the insulation body to the plane surface, to feed a first electromagnetic signal; and

a first radiator, substantially positioned on a center of the plane surface of the insulation body, and electrically connected to the first feed portion, to radiate the first electromagnetic signal; and

a microstrip antenna, comprising:

a second feed portion, to feed a second electromagnetic signal; and

a second radiator, being a microstrip, electrically connected to the second feed portion and positioned on the side surface of the insulation body, to radiate the second electromagnetic signal.

2. The dual-band antenna assembly as claimed in claim 1 , wherein the insulation body is made of ceramic having a high dielectric constant.

3. The dual-band antenna assembly as claimed in claim 2 , wherein the insulation body is cubical shaped.

4. The dual-band antenna assembly as claimed in claim 1 , wherein the first feed portion and the second feed portion are radio frequency (RF) cables.

5. The dual-band antenna assembly as claimed in claim 4 , wherein the second feed portion is parallel to the first feed portion, and passes from the substrate through the insulator to the plane surface.

6. The dual-band antenna assembly as claimed in claim 5 , wherein the second radiator is helically coiled around the side surface of the insulation body.

7. The dual-band antenna assembly as claimed in claim 4 , wherein the second radiator extends from the plane surface of the insulation body to substrate.

8. The dual-band antenna assembly as claimed in claim 1 , wherein the first feed portion is a radio frequency (RF) cable, and wherein the second feed potion is a feed via positioned on the substrate, and clings to the side surface of the insulation body.

9. The dual-band antenna assembly as claimed in claim 8 , wherein the second radiator is wave-shaped, arranged around the side surface of the insulation body.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2025
From: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
To: SHENZHEN FULIAN FUGUI PRECISION INDUSTRY CO., LTD.
Reel/Frame 073521/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2018
From: AMBIT MICROSYSTEMS (SHANGHAI) LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
Reel/Frame 045171/0409 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2009
From: CHEN, MIN; CHUNG, CHO-JU
To: AMBIT MICROSYSTEMS (SHANGHAI) LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 023577/0400 →