Method and pattern of dispensing thermal interface materials
View Patent ↗An interface is formed by pressing a first surface and a second surface together, with a particle-loaded thermal interface material (TIM) in between. By applying the thermal interface material to controlled locations on the first surface in controlled amounts, final layer thickness at a given squeezing pressure, and time required to squeeze, are minimized. The locations and amounts are controlled such that small islands of TIM merge only just before final layer thickness is achieved. Better TIM thermal performance and quicker manufacturing result.
1. A method of dispensing comprising:
providing a first surface adapted to at with a second surface, and a flowable substantially heat-conducting interlace material adapted to form a layer between the first surface and second surface to conduct heat;
depositing the interface material on the first surface in an optimized deposition pattern comprising a plurality of discrete regions of interface material which are respective separated by gas within gas flow passages, each region comprising locations of interface material and a respective amount of interface material at each respective location being optimized according to an output of at least one automated processor executing a computational flow dynamics model responsive to at least the first surface, the second surface, and the deposition pattern and physical properties of the interface material; and
compressing the first and second surfaces, to spread out the discrete regions of the interface material, the position pattern being optimized to form a thin contiguous final layer of interface material substantially without trapped gas between the first surface and the second surface as a result of compression to a terminal thickness limited based on a shear yield stress of the interface material, the patency of the gas flow passages being maintained during compression and then collapsing just prior to when the thin contiguous final layer achieves a terminal thickness,
wherein the deposition pattern of interface material is further optimized by the at least one automated processor executing a computational flow dynamics model according to one or more criteria selected from the group consisting of processing time, peak squeezing force, average squeezing force, squeezing force profile, thermal conductivity, operating temperature, prescribed thermal conductivity as a function of location, prescribed normal operating temperature as a function of location, peak operating temperature as a function of location, cost, cost-benefit and yield.
2. The method of claim 1 , in which the optimized pattern comprises parallel lines.
3. The method of claim 1 , wherein the optimized pattern comprises a set of locations and amounts of interface material which are selected such that particle agglomeration will terminate the squeezing just after the final continuous interlace material layer is achieved.
4. The method of claim 1 , further comprising reducing a pressure of the gas separating the interface material.
5. The method of claim 2 , in which the lines are spaced at a pitch smaller than 10% of a side length of said first surface.
6. The method of claim 1 , Wherein the optimized pattern comprises a plurality of islands.
7. The method of claim 6 , in which the islands number 10 or more.
8. The method of claim 1 , Wherein the optimized pattern comprises a branched structure.
9. The method of claim 1 , in which the compression is conducted under less than 10 psi.
10. The method of claim 9 , in which the thickness of the final layer is 20 microns or smaller.
11. The method of claim 1 , wherein the one of more criteria comprises processing time.
12. The method of claim 1 , wherein the one of more criteria composes peak squeezing force.
13. The method of claim 1 , wherein the one of more criteria comprises average squeezing force.
14. The method of claim 1 , wherein the one of more criteria comprises squeezing force profile.
15. The method of claim 1 , wherein the one of more criteria comprises thermal conductivity between the first surface, the final layer, and the second surface.
16. The method of claim 1 , wherein the one of more criteria comprises an operating temperature of a device associated with at least one of the first surface and the second surface.
17. The method of claim 1 , wherein the one of more criteria composes prescribed thermal conductivity as it function of location.
18. The method of claim 1 , wherein the one of more criteria comprises a prescribed normal operating temperature as a function of location.
19. The method of claim 1 , wherein the one of more criteria comprises a peak operating temperature as a function of location.
20. The method of claim 1 wherein the one of more criteria comprises a cost.
21. The method of claim 1 , wherein the one of more criteria comprises a cost-benefit.
22. The method of claim 1 , wherein the one of more criteria comprises a yield.