IP Library Granted Patent US 8,954,001
Granted Patent B2
US 8,954,001 · App. 12/628,401 · Granted Feb 10, 2015

Power bridge circuit for bi-directional wireless power transmission

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Quick Facts
Patent No.
US 8,954,001
App. No.
12/628,401
Granted
Feb 10, 2015
Kind
B2
Abstract

An inductive signal interface includes a coil assembly which has one or more inductive coils. The inductive signal interface also has a bridge circuit that couples to the coil assembly to a power input/output (I/O). The bridge circuit has components that operate to enable the inductive signal interface to selectively operate in either a power transmit mode or a power receive mode.

Claims (31)

1. An inductive signal interface comprising:

a coil assembly comprising one or more inductive coils; and

a bridge circuit that extends between the coil assembly and a power input/output (I/O), the bridge circuit to enable the inductive signal interface to selectively operate in either a power transmit mode or in a power receive mode.

2. The inductive signal interface of claim 1 , wherein the bridge circuit includes three branches, the three branches including a shared branch that is operative in both the power transmit mode and the power receive mode, each branch comprising an arrangement of switches that alternatively route current (i) to the shared current branch from the power I/O to transmit power, and (ii) from the shared current branch to the power I/O to receive power, to coincide with the inductive signal interface operating in the power transmit mode and in the power receive mode.

3. The inductive signal interface of claim 2 , wherein two of the three branches operate to form an H-bridge circuit while the inductive signal interface operates in the power transmit mode.

4. The inductive signal interface of claim 2 , wherein two of the three branches operate to form a synchronous bridge rectifier circuit while the inductive signal interface operates in the power receive mode.

5. The inductive signal interface of claim 1 , wherein the bridge circuit is to receive a direct current from a supply voltage and to transmit a high-current to the coil assembly in the power transmit mode.

6. The inductive signal interface of claim 1 , wherein the bridge circuit is to receive an alternating current from the coil assembly and to output a direct current in the power receive mode.

7. The inductive signal interface of claim 1 , wherein the bridge circuit is to receive a plurality of switch control signals from a control circuit that enables the inductive signal interface to selectively operate in either the power transmit mode or in the power receive mode.

8. The inductive signal interface of claim 1 , wherein the coil assembly includes a capacitor.

9. The inductive signal interface of claim 8 , wherein the bridge circuit is to route current (i) to the coil assembly through a series combination of the capacitor and one of the one or more inductive coils during the power transmit mode and (ii) from the coil through at least one inductive coil during the power receive mode.

10. The inductive signal interface of claim 1 , wherein the inductive signal interface is to transmit and receive data inductively.

11. The inductive signal interface of claim 10 , further comprising a modulator and a demodulator to facilitate the transmission and reception of data.

12. The inductive signal interface of claim 10 , further comprising a communication coil for transmitting and receiving the data inductively.

13. The inductive signal interface of claim 10 , wherein the coil assembly is to inductively transmit and receive data.

14. A mobile computing device comprising:

an inductive signal interface;

a coil assembly comprising one or more inductive coils; and

a bridge circuit that extends between the coil assembly and a power input/output (I/O), the bridge circuit to enable the inductive signal interface to operate in both a power transmit mode and in a power receive mode.

15. A computing assembly comprising:

a first computing device;

a second computing device;

wherein each of the first and second computing devices include an inductive signal interface to enable the first and second computing devices to inductively transfer power;

wherein the inductive signal interface of each of the first and second computing devices comprises:

a coil assembly comprising one or more inductive coils; and

a bridge circuit that extends between the coil assembly and a power input/output (I/O), the bridge circuit to enable the inductive signal interface to operate in both a power transmit mode and in a power receive mode.

16. The computing assembly of claim 15 , wherein the bridge circuit of each of the first and second computing devices includes three branches, the three branches including a shared branch that is operative in both the power transmit mode and the power receive mode, each branch comprising an arrangement of switches that alternatively route current (i) to the shared current branch from the power I/O to transmit power, and (ii) from the shared current branch to the power I/O to receive power, to coincide with the inductive signal interface operating in the power transmit mode and in the power receive mode.

17. The computing assembly of claim 16 , wherein two of the three branches of the power bridge circuit of the first computing device operate to form an H-bridge circuit, and wherein the inductive signal interface of the first computing device operates in the power transmit mode.

18. The computing assembly of claim 17 , wherein two of the three branches of the power bridge circuit of the second computing device operate to form a synchronous bridge rectifier circuit, and wherein the inductive signal interface of the second computing device operates in the power receive mode.

19. The computing assembly of claim 18 , wherein the first computing device is a docking station and the second computing device is a mobile computing device.

20. The computing assembly of claim 15 , wherein the first computing device inductively transmits power to the second computing device.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2014
From: HEWLETT-PACKARD COMPANY; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; PALM, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 032132/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 031837/0544 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0659 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 030341/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2010
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 025204/0809 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2010
From: CHATTERJEE, MANJIRNATH
To: PALM, INC.
Reel/Frame 023803/0861 →