Single chip multicolor package

1. An opto-electronic device package structure emitting multicolor light, comprising:

a transparent carrier having a first surface and a second surface;

a circuit layer on the first surface of the transparent carrier;

an opto-electronic device emitting light of a first wavelength and is electrically connecting with the circuit layer on the transparent carrier;

a first wavelength conversion structure on the lateral side of the opto-electronic device, wherein the first wavelength conversion structure converting the light of the first wavelength emitting from the lateral side of the opto-electronic device into light of a second wavelength;

a reflective layer on the first wavelength conversion structure, wherein the light of the second wavelength is reflected to the first wavelength conversion structure by the reflective layer and emitted from the second surface of the transparent carrier; and

a transparent material for package on the reflective layer and on the opto-electronic device for the light of the first wavelength passing through the transparent material for package.

2. The opto-electronic device package structure according to claim 1 , wherein the first wavelength light is blue light.

3. The opto-electronic device package structure according to claim 1 , wherein the second wavelength light is white light.

4. An opto-electronic device package structure emitting multicolor light, comprising:

a transparent carrier having a first surface and a second surface;

a circuit layer on the first surface of the transparent carrier;

an opto-electronic device emitting light of a first wavelength and is electrically connecting with the circuit layer on the transparent carrier;

a first wavelength conversion structure on the lateral side of the opto-electronic device, wherein the first wavelength conversion structure converting the light of the first wavelength emitting from the lateral side of the opto-electronic device into light of a second wavelength;

a reflective layer on the first wavelength conversion structure, wherein the light of the second wavelength is reflected to the first wavelength conversion structure by the reflective layer and emitted from the second surface of the transparent carrier;

a second wavelength conversion structure on the reflective layer and on the opto-electronic device, wherein the light of the first wavelength emitting from the opto-electronic device is converted into light of a third wavelength by the second wavelength conversion structure; and

a transparent material for package on the second wavelength conversion structure for the light of the third wavelength passing through the transparent material for package.

5. The opto-electronic device package structure according to claim 4 , wherein the first wavelength light is ultraviolet light.

6. The opto-electronic device package structure according to claim 4 , wherein the second wavelength light is white light.

7. The opto-electronic device package structure according to claim 4 , wherein the third wavelength light is blue light.

8. The opto-electronic device package structure according to claim 1 , wherein the opto-electronic device is in a single chip form.

9. The opto-electronic device package structure according to claim 4 , wherein the opto-electronic device is in a single chip form.

10. An opto-electronic device module for multicolor light comprising an opto-electronic device package structure according to claim 1 .

11. A display showing information at two sides comprising an opto-electronic device package structure according to claim 1 .

12. An opto-electronic device module for multicolor light comprising an opto-electronic device package structure according to claim 4 .

13. A display showing information at two sides comprising an opto-electronic device package structure according to claim 4 .