IP Library Granted Patent US 8,333,855
Granted Patent B2
US 8,333,855 · App. 12/629,275 · Granted Dec 18, 2012

Monitoring electrical continuity for envelope seal integrity

Assignee: Pitney Bowes Inc.
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Quick Facts
Patent No.
US 8,333,855
App. No.
12/629,275
Granted
Dec 18, 2012
Kind
B2
Abstract

A method for producing an envelope having improved seal integrity, comprising the steps of (i) applying a first conductive material to the flap of the envelope in an first area corresponding to a first seal location between the flap and the body portion of the envelope and (ii) applying a second conductive material to the body portion of the envelope in a second area corresponding to a second seal location between the body portion and flap of the envelope, the first and second seal locations being selected such that an end of the first conductive material contacts an end of the second conductive material when the conductive materials are arranged in a substantially common plane. The method further comprises the steps of sealing the flap to the body portion by closing the flap onto the body portion of the envelope to cause the conductive materials to lie in the substantially common plane, and inspecting the sealing interface to determine whether the conductive materials exhibit a property of electrical continuity thereby confirming that a seal has been formed between the flap and body portion of the envelope. A system and article is also described for producing an envelope having improved seal integrity.

Claims (7)

1. A method for producing an envelope having improved seal integrity, the envelope having a flap and a body portion between which a seal is formed, the method comprising the steps of:

applying a first conductive material to the flap of the envelope in an first area between the flap and the body portion of the envelope;

applying a second conductive material to the body portion of the envelope in a second area between the body portion and flap of the envelope, the first and second areas being selected such that an end of the first conductive material contacts an end of the second conductive material when the conductive materials are arranged in a substantially common plane;

sealing the flap to the body portion by closing the flap onto the body portion of the envelope and causing the conductive materials to lie in the substantially common plane;

inspecting the sealing interface to determine whether the conductive materials exhibit a property of electrical continuity thereby confirming that a seal has been formed between the flap and body portion of the envelope, the step of inspecting the sealing interface including the steps of: (i) exposing the sealing interface to an electromagnetic field, and (ii) measuring the capacitance through the interface to determine whether the capacitance is between a threshold range of values indicative of a reliable seal.

2. The method according to claim 1 wherein the step of applying a first conductive material to the flap of the envelope includes providing a first plurality of conductive strips in spaced-apart relation along the sealing interface, wherein the step of applying a second conductive material to the body of the envelope includes providing a second plurality of conductive strips in spaced apart relation along the sealing interface, and wherein the edges of the first and second plurality overlap to produce a single conductive element along the sealing interface.

3. The method according to claim 1 further comprising the step of applying a sealant along the sealing interface of the flap and body portions of the envelope, and wherein the step of applying a sealant includes the step of applying the sealant to areas between the tip end portions of the first and second conductive materials to prevent the tip end portions from being insulated by the sealant when producing the sealing interface of the envelope.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Aug 30, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: DMT SOLUTIONS GLOBAL CORPORATION
Reel/Frame 064785/0325 →
RELEASE OF SECURITY INTEREST Recorded Aug 30, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: DMT SOLUTIONS GLOBAL CORPORATION
Reel/Frame 064785/0374 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2018
From: PITNEY BOWES INC.
To: DMT SOLUTIONS GLOBAL CORPORATION
Reel/Frame 046597/0120 →
TERM LOAN SECURITY AGREEMENT Recorded Jul 3, 2018
From: DMT SOLUTIONS GLOBAL CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 046473/0586 →
SECURITY AGREEMENT Recorded Jul 2, 2018
From: DMT SOLUTIONS GLOBAL CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 046467/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2010
From: KLINE, JOHN
To: PITNEY BOWES INC.
Reel/Frame 024051/0229 →
Continuity (1)
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