IP Library Granted Patent US 8,459,881
Granted Patent B2
US 8,459,881 · App. 12/629,650 · Granted Jun 11, 2013

Electromagnetic radiation containment in an optoelectronic module

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Quick Facts
Patent No.
US 8,459,881
App. No.
12/629,650
Granted
Jun 11, 2013
Kind
B2
Abstract

Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.

Claims (64)

1. An electromagnetic radiation (EMR) containment assembly comprising:

an EMR shield comprising:

a first substantially flat body defining at least one edge;

a plurality of optical ports defined in the first body; and

a plurality of fingers defined along and extending from at least one edge of the first body, the fingers configured to bias against a housing of an optoelectronic module in a first direction; and

a mounting spring plate attached to the EMR shield, the mounting spring plate comprising:

a second substantially flat body defining at least one edge;

an optical window defined in the second body; and

a plurality of leaf springs defined along and extending from at least one edge of the second body, the leaf springs configured to bias against an alignment guide positioned within the optoelectronic module in a second direction that is perpendicular to the first direction.

2. The EMR containment assembly as recited in claim 1 , wherein the EMR containment assembly comprises stamped sheet metal and the EMR shield is spot welded to the mounting spring plate.

3. The EMR containment assembly as recited in claim 1 , wherein the plurality of finger extend radially outward from the first body at substantially regular intervals.

4. The EMR containment assembly as recited in claim 1 , wherein the EMR shield further comprises:

one or more alignment pin openings defined in the first substantially flat body; and

one or more alignment post openings defined in the first substantially flat body.

5. The EMR containment assembly as recited in claim 4 , wherein the mounting spring plate further comprises:

one or more alignment post openings defined in the leaf springs.

6. An optoelectronic module comprising:

a housing comprising a top shell and a bottom shell;

a printed circuit board (PCB) at least partially enclosed within the housing;

a lens block enclosed within the housing;

an alignment guide aligned with the lens block; and

an EMR containment assembly positioned between the lens block and the alignment guide, the EMR containment assembly comprising:

an EMR shield comprising:

a first substantially flat body defining at least one edge;

a plurality of optical ports defined in the first body; and

a plurality of fingers defined along at least one edge of the first body, each finger being biased against the top shell or the bottom shell; and

a mounting spring plate attached to the EMR shield, the mounting spring plate comprising:

a second substantially flat body defining at least one edge; and

a plurality of leaf springs defined along at least one edge of the second body, each leaf spring being biased against the alignment guide.

7. The optoelectronic module as recited in claim 6 , wherein the lens block holds a transmitter array and a receiver array, and wherein the transmitters are configured to transmit multiple optical signals through at least one of the optical ports and the receivers are configured to receive multiple optical signals through at least one of the optical ports.

8. The optoelectronic module as recited in claim 7 , further comprising a conductive mounting plate positioned proximate the transmitter and receiver arrays and proximate a protruding heat spreader of the top shell, wherein the biasing of the leaf causes the conductive mounting plate to be pressed firmly against the protruding heat spreader.

9. The optoelectronic module as recited in claim 6 , wherein the EMR containment assembly comprises stamped sheet metal and the EMR shield is spot welded to the mounting spring plate.

10. The optoelectronic module as recited in claim 6 , wherein each finger is biased against an inside rim of the top shell or an inside rim of the bottom shell.

11. The optoelectronic module as recited in claim 6 , wherein the EMR shield is attached to the lens block via one or more alignment pins.

12. The optoelectronic module as recited in claim 6 , wherein the optoelectronic module is substantially compliant with the QSFP MSA or the CXP MSA.

13. The optoelectronic module as recited in claim 6 , wherein:

the plurality of fingers extend from the at least one edge of the first body;

the plurality of fingers bias against the top shell or the bottom shell in a first direction;

the plurality of leaf springs extend from the at least one edge of the second body; and

the plurality of leaf springs bias against the alignment guide in a second direction that is perpendicular to the first direction.

14. An active cable comprising:

a communications cable comprising one or more optical fibers, the communications cable having first and second ends; and

first and second optoelectronic modules attached to the first and second ends of the communications cable, respectively, each optoelectronic module comprising:

a housing comprising a top shell and a bottom shell;

a PCB at least partially enclosed within the housing;

transmitter and receiver arrays in electrical communication with the PCB;

an alignment guide, a portion of each of the optical fibers positioned within the alignment guide and mechanically aligned with the transmitter or receiver arrays; and

an EMR containment assembly positioned between the transmitter and receiver arrays and the alignment guide, the EMR containment assembly comprising:

an EMR shield comprising:

a first body defining at least one edge;

a plurality of optical ports defined in the first body; and

a plurality of fingers defined along at least one edge of the first body, each finger being biased against the top shell or the bottom shell; and

a mounting spring plate attached to the EMR shield, the mounting spring plate comprising:

a second body defining at least one edge; and

a plurality of leaf springs defined along at least one edge of the second body, each leaf spring being biased against the alignment guide.

15. The active cable as recited in claim 14 , wherein the alignment guide includes a protrusion that is firmly in contact with an edge of an opening in the bottom shell.

16. The active cable as recited in claim 14 , wherein the EMR shield is attached to the optoelectronic module via one or more alignment pins.

17. The active cable as recited in claim 14 , wherein the communications cable includes either twelve optical fibers or twenty-four optical fibers.

18. The active cable as recited in claim 14 , wherein each optoelectronic module is substantially compliant with the QSFP MSA or the CXP MSA.

19. The active cable as recited in claim 14 , wherein:

the plurality of fingers extend from the at least one edge of the first body;

the plurality of fingers bias against the top shell or the bottom shell in a first direction;

the plurality of leaf springs extend from the at least one edge of the second body; and

the plurality of leaf springs bias against the alignment guide in a second direction that is perpendicular to the first direction.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2009
From: TOGAMI, CHRIS K.; SASSER, GARY; FLENS, FRANK
To: FINISAR CORPORATION
Reel/Frame 023683/0370 →