LED package with wide emission range and effective heat dissipation
View Patent ↗There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.
1. A light emitting diode (LED) package comprising:
a body unit having a plurality of thermal pins protruding from an outer surface thereof in a radial direction;
an LED chip mounted on an upper side of the body unit;
lead frames mounted on the upper side of the body unit and electrically connected to the LED chip;
a molding material for insulting the body unit with the lead frames; and
a reflection unit formed on the upper side of the body unit, the reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside, wherein:
the reflection unit has a curved cross-section, and
ends of the plurality of thermal pins protrude from the molding material in a radial direction and are exposed to the outside.
2. The LED package of claim 1 , wherein the reflection unit has a semicircular cross-section.
3. The LED package of claim 1 , wherein the reflection unit has a cross-section having rounded edges and a flat top.
4. The LED package of claim 1 , wherein:
filling spaces for the molding material are created between the thermal pins, and
the molding material is injected between the filling spaces, into the bottom of the body unit and the top of the body unit and between the lead frames.
5. The LED package of claim 1 , wherein each of the lead frames comprises a mounting portion provided on the upper side of the body unit, an outer bent portion extending in a perpendicular direction from the end of the mounting portion, and a lower bent portion extending in the perpendicular direction from the end of the outer bent portion.
6. The LED package of claim 1 , wherein a molding fixing unit is further provided onto an upper surface of each of the lead frames so that the each of the lead frames is fixed to the body unit.
7. The LED package of claim 1 , further comprising filling materials introduced in the cavity to protect the LED chip.
8. The LED package of claim 7 , further comprising at least one phosphor coated on the top of the filling materials.