IP Library Granted Patent US 8,365,399
Granted Patent B2
US 8,365,399 · App. 12/630,677 · Granted Feb 5, 2013

Method of connecting components to a printed circuit board

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Quick Facts
Patent No.
US 8,365,399
App. No.
12/630,677
Granted
Feb 5, 2013
Kind
B2
Abstract

A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Claims (14)

1. A method of connecting components to a printed circuit board comprising:

forming a printed circuit board having a first face, a second face opposite the first face, and a plurality of conductive layers disposed between nonconductive layers;

drilling a hole into the first face of the printed circuit board to a predetermined depth intermediate the first and second faces, wherein the hole extends through a first subset of the conductive layers but does not extend through a second subset of the conductive layers;

installing a first component along the first face by inserting a mechanical locating pin into the hole; and

installing a second component on the second face directly opposite of the hole;

wherein the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

2. The method of claim 1 , wherein the printed circuit board is a backplane.

3. The method of claim 1 , wherein the first component is a disk drive.

4. The method of claim 1 , wherein the second component is an integrated circuit in electronic communication with the conductive traces or interconnects through a ball grid array.

5. The method of claim 1 , wherein the hole extends through less than or equal to half of the conductive layers.

6. The method of claim 1 , further comprising:

drilling a plurality of the holes in the first face of the printed circuit board; and

installing a plurality of components along the first face by inserting mechanical locating pins into the plurality of holes.

7. The method of claim 6 , wherein the plurality of components include disk drives and the plurality of holes are arranged to align the disk drives in a compact arrangement.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 034194/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2009
From: ANDRESEN, MARK D.; OTT, VIRGINIA
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 023629/0602 →