Coplanar high fill factor pixel architecture
View Patent ↗A pixel comprising a scan line proximate to a first surface of a substrate and a bias line between the first surface of the substrate and a first terminal of a photosensing element, where a portion of the bias line is substantially parallel to the scan line. The pixel can also comprise a switching element proximate to the first surface of the substrate and aligned with at least a portion of the scan line. The pixel can include the photosensing element proximate to the first surface of the substrate and aligned with at least a portion of the bias line.
1. A pixel, comprising:
a scan line proximate to a first surface of a substrate;
a bias line between the first surface of the substrate and a first terminal of a photoelectric conversion element, wherein the bias line is substantially parallel to the scan line;
a switching element proximate to the first surface of the substrate and aligned with at least a portion of the scan line, comprising:
a first terminal;
a second terminal; and
a gate electrode electrically coupled to the scan line, wherein the first terminal and the second terminal are electrically coupled based on a scan signal from the scan line; and
the photoelectric conversion element proximate to the first surface of the substrate and aligned with at least a portion of the bias line, comprising:
the first terminal electrically coupled to the bias line; and
a second terminal electrically coupled to the first terminal of the switching element.
2. The pixel of claim 1 , wherein a second bias line is transverse to another portion of the scan line.
3. The pixel of claim 1 , wherein a fill factor for the pixel is between about 70% and about 89%.
4. The pixel of claim 1 , wherein the bias line and the scan line are formed in a same metal layer.
5. The pixel of claim 4 , wherein the gate electrode is formed in the same metal layer as the bias line and the scan line.
6. The pixel of claim 1 , wherein a portion of the photoelectric conversion element is proximate to at least one of a portion of the scan line, a portion of a data line, and a combination thereof.
7. The pixel of claim 1 , wherein the bias line is wider than the scan line.
8. The pixel of claim 1 , wherein the photoelectric conversion element is selected from the group of: n-i-p photodiodes, p-n junction photodiodes, MIS photosensors, and phototransistors.
9. The pixel of claim 1 , wherein the switching element is selected from the group of: MOS thin-film-transistors, junction field-effect-transistors, fully-depleted SOI transistors, partially-depleted SOI transistors, SiOG transistors, bulk MOS transistors, and bi-polar transistors.
10. The pixel of claim 1 , wherein the photoelectric conversion element includes at least one semiconducting layer, and that at least one semiconducting layer is selected from the group of: amorphous silicon, micro-crystalline silicon, poly-crystalline silicon, single-crystal silicon, an organic semiconductor, and metal oxide semiconductors.
11. The pixel of claim 1 , wherein the switching element includes at least one semiconducting layer, and the at least one semiconducting layer is selected from the group of amorphous silicon, micro-crystalline silicon, poly-crystalline silicon, single-crystal silicon, an organic semiconductor, and metal oxide semiconductors.
12. The pixel of claim 1 , wherein the first terminal of the photoelectric conversion element is a cathode and the second terminal of the photoelectric conversion element is an anode.
13. The pixel of claim 1 , wherein the first terminal of the photoelectric conversion element is an anode and the second terminal of the photoelectric conversion element is a cathode.
14. The pixel of claim 1 , further comprising an additional metal layer between the bias line and the photoelectric conversion element.
15. An imaging array comprising a plurality of pixels electrically connected in rows and columns according to claim 1 , wherein the scan line and the bias line are common to the plurality of pixels.
16. A radiation imaging system comprising:
at least one imaging array comprising: a plurality of pixels according to claim 1 , driving circuits, and readout circuits; and
a phosphor screen configured to convert radiation into light proximate to the plurality of pixels.
17. The radiation imaging system of claim 16 , further comprising a radiation source for generating radiation.
18. A pixel, comprising:
a scan line proximate to a first surface of a substrate;
a bias line between the first surface of the substrate and a first terminal of a photoelectric conversion element, wherein the bias line is substantially transverse to a portion of the scan line;
a switching element proximate to the first surface of the substrate and aligned with at least a portion of the scan line, comprising:
a first terminal;
a second terminal; and
a gate electrode electrically coupled to the scan line, wherein the first terminal and the second terminal are electrically coupled based on a scan signal from the scan line; and
the photoelectric conversion element proximate to the first surface of the substrate and aligned with at least a portion of the bias line, comprising:
the first terminal electrically coupled to the bias line; and
a second terminal electrically coupled to the first terminal of the switching element.
19. The pixel of claim 18 , wherein a portion of the photoelectric conversion element is proximate to at least one of a portion of the scan line, a portion of a data line, and a combination thereof.
20. The pixel of claim 18 , wherein the bias line is wider than the scan line.
21. The pixel of claim 18 , wherein the photoelectric conversion element is selected from the group of: n-i-p photodiodes, p-n junction photodiodes, MIS photosensors, and phototransistors.
22. The pixel of claim 18 , wherein the switching element is selected from the group of: MOS thin-film-transistors, junction field-effect-transistors, fully-depleted SOI transistors, partially-depleted SOI transistors, SiOG transistors, bulk MOS transistors, and bi-polar transistors.
23. The pixel of claim 18 , wherein the photoelectric conversion element includes at least one semiconducting layer, and the at least one semiconducting layer is selected from the group of: amorphous silicon, micro-crystalline silicon, poly-crystalline silicon, single-crystal silicon, an organic semiconductor, and metal oxide semiconductors.
24. The pixel of claim 18 , wherein the switching element includes at least one semiconducting layer, and the at least one semiconducting layer is selected from the group of amorphous silicon, micro-crystalline silicon, poly-crystalline silicon, single-crystal silicon, an organic semiconductor, and metal oxide semiconductors.
25. The pixel of claim 18 , wherein the first terminal of the photoelectric conversion element is a cathode and the second terminal of the photoelectric conversion element is an anode.
26. The pixel of claim 18 , wherein the first terminal of the photoelectric conversion element is an anode and the second terminal of the photoelectric conversion element is a cathode.
27. The pixel of claim 18 , further comprising an additional metal layer between the bias line and the photoelectric conversion element.
28. An imaging array comprising a plurality of pixels electrically connected in rows and columns according to claim 18 , wherein the scan line and the bias line are common to the plurality of pixels.