Qualifying circuit board materials
View Patent ↗A test structure for testing electrical properties of a material comprises a first loop and a second loop, which are connected to form a closed test loop. A signal generator, for generating a test signal, is coupled to the first loop and the second loop. A signal propagation switching logic is coupled to the first loop and to the second loop for alternatingly flipping the test signal between the first and second loops, such that the test signal moves uninterrupted through the closed test loop. A probe logic detects any degradation of the test signal as the test signal travels along the closed test loop.
1. A method of testing a signal degradation caused by properties of insulating material between conducting material, the method comprising:
coupling a test structure to a processor, wherein the test structure comprises:
a first loop of conducting material, wherein the first loop has a first end and a second end;
a second loop of the conducting material, wherein the second loop has a third end and a fourth end;
a closed test loop of the conducting material made up of the second end connected to the third end and the first end connected to the fourth end;
a signal generator coupled to the first loop and the second loop, wherein the signal generator generates a test signal;
a signal propagation switching logic coupled to the first loop and to the second loop, wherein the signal propagation switching logic alternatingly flips the test signal between the first and second loops to permit the test signal to move uninterrupted through the closed test loop; and
a probe logic for detecting a degradation of the test signal as the test signal travels along the closed test loop;
the signal generator initiating the test signal at the first end of the first loop;
the probe logic detecting a degraded test signal at the second end of the first loop;
the signal propagation switching logic flipping the degraded test signal to the third end of the second loop while flipping the fourth end of the second loop to zero;
the probe logic detecting a further degraded test signal at the fourth end of the second loop;
the signal propagation switching logic flipping the further degraded test signal to the first end of the first loop while flipping the second end of the first loop to zero; and
repeating the detecting and flipping until a testing cycle is completed, wherein the degraded and further degraded test signals result from signal leakage from the conducting material into the insulating material.
2. The method of claim 1 , wherein the test signal is a voltage, and wherein the degraded and further degraded test signals are a voltage drop of the test signal as the test signal travels through the closed test loop.
3. The method of claim 1 , further comprising:
displaying the degraded and further degraded test signals.
4. A method of testing a signal degradation caused by properties of the conducting material, the method comprising:
coupling a test structure to a processor, wherein the test structure comprises:
a first loop having a first end and a second end;
a second loop having a third end and a fourth end;
a closed test loop made up of the second end connected to the third end and the first end connected to the fourth end;
a signal generator coupled to the first loop and the second loop, wherein the signal generator generates a test signal;
a signal propagation switching logic coupled to the first loop and to the second loop, wherein the signal propagation switching logic alternatingly flips the test signal between the first and second loops to permit the test signal to move uninterrupted through the closed test loop; and
a probe logic for detecting a degradation of the test signal as the test signal travels along the closed test loop;
the signal generator initiating the test signal at the first end of the first loop;
the probe logic detecting a degraded test signal at the second end of the first loop;
the signal propagation switching logic flipping the degraded test signal to the third end of the second loop while flipping the fourth end of the second loop to zero;
the probe logic detecting a further degraded test signal at the fourth end of the second loop;
the signal propagation switching logic flipping the further degraded test signal to the first end of the first loop while flipping the second end of the first loop to zero; and
repeating the detecting and flipping until a testing cycle is completed, wherein the degraded and further degraded test signals result from properties of the conducting material.
5. The method of claim 4 , wherein the test signal is a voltage, and wherein the degraded and further degraded test signals are a voltage drop of the test signal as the test signal travels through the closed test loop.
6. The method of claim 4 , further comprising:
displaying the degraded and further degraded test signals.