Heat treatment apparatus and method of manufacturing semiconductor device
View Patent ↗Provided is a heat treatment apparatus including a treatment chamber housing a silicon substrate, a heater being provided in the treatment chamber and heating the silicon substrate, and an atmosphere adjustment mechanism reducing a concentration of oxygen contained in an atmosphere inside the treatment chamber to less than an oxygen concentration in the air. The atmosphere adjustment mechanism is provided with an oxygen trap, for example.
1. A heat treatment apparatus comprising:
a treatment chamber housing a semiconductor substrate;
a heater provided in the treatment chamber and heating the semiconductor substrate;
an atmosphere adjustment mechanism reducing a concentration of oxygen contained in an atmosphere in the treatment chamber to less than an oxygen concentration in an air, where the atmosphere adjustment mechanism comprises a circulation path which circulates the atmosphere, the atmosphere being circulated within the treatment chamber; and
an oxygen trap provided in the circulation path for the atmosphere and selectively removing oxygen from the atmosphere; and
a hydrogen trap provided in the circulation path for the atmosphere and selectively removing hydrogen from the atmosphere.
2. The heat treatment apparatus according to claim 1 ,
wherein an introduction path for a cooling gas of room temperature is joined to the circulation path at a position upstream of the oxygen trap.
3. The heat treatment apparatus according to claim 2 ,
wherein the cooling gas is any one of air and nitrogen gas.
4. The heat treatment apparatus according to claim 1 ,
wherein an oxygen concentration meter is provided in the treatment chamber, where the oxygen concentration meter measuring the oxygen concentration in the atmosphere .
5. The heat treatment apparatus according to claim 1 ,
wherein a hydrogen concentration meter is provided in the treatment chamber, where the hydrogen concentration meter measuring the hydrogen concentration in the atmosphere.
6. The heat treatment apparatus according to claim 1 , further comprising:
a door which shields the treatment chamber from outside air; and
a partition wall provided in the treatment chamber, the partition wall being openable and closable,
wherein the partition wall partitions the treatment chamber into a first treatment chamber located next to the door and a second treatment chamber located farther from the door, and
the heater and the atmosphere adjustment mechanism are provided in each of the first treatment chamber and the second treatment chamber.
7. The heat treatment apparatus according to claim 6 ,
wherein a volume of the first treatment chamber is smaller than a volume of the second treatment chamber.