Channel performance of electrical lines
View Patent ↗A first via and a second via pass through a layer of a multi-layered circuit board. A first set of electrical transmission line segments, each having a first thickness, is aligned at a first area on the layer between the first and second vias. A second set of electrical transmission line segments, each having a second thickness that is greater than the first thickness, are aligned at a second area that is offset to the first area and to the first and second vias. The first set of electrical transmission line segments is connected to the second set of electrical transmission line segments to form an electrical transmission line, which has an average impedance that matches a line impedance of a uniform thickness line.
1. A circuit board comprising: a layer; a first via passing through the layer; a second via passing through the layer: a first set of electrical transmission line segments at a first area of the layer, wherein the first area is between the first and second vias and wherein at least one of the first set of electrical transmission line segments has a first thickness; and a second set of electrical transmission line segments on a second area of the layer, wherein the second area is offset to the first area and to the first and second vias, wherein, at least one of the second, set of electrical transmission line segments has a second thickness that is greater than the first thickness wherein the first set of electrical transmission line segment is connected to the second set of electrical transmission line segment to form an electrical transmission line, wherein an anti-pad area surrounds the first via, wherein circuitry is prohibited within the anti-pad area wherein the first and second thicknesses cause the electrical transmission line to have an average impedance that matches a line impedance of a uniform thickness line, and a connector line connected to the electrical transmission line, wherein the connector line has the line impedance of the uniform thickness line.
2. The circuit board of claim 1 , wherein the circuit board comprises multiple layers.
3. The circuit board of claim 1 , wherein the electrical transmission line is a single transmission line, and wherein the first and second sets of electrical transmission line segments form the single transmission line.
4. The circuit board of claim 1 , wherein the electrical transmission line is composed of two transmission lines, and wherein the first and second sets of electrical transmission line segments both form the two lines.
5. The circuit board of claim 1 , wherein the first and second sets of electrical transmission line segments each comprise more than two lines.
6. The circuit board of claim 4 , wherein both lines formed by the first set of electrical transmission line segments have the first thickness, and wherein both lines formed by the second set of electrical transmission line segments have the second thickness.
7. The circuit board of claim 4 , wherein at least one of the lines from the first set of electrical transmission line segments curves around the anti-pad area.
8. The circuit board of claim 4 , wherein the lines in the second set of electrical transmission line segments are aligned closer together than the lines in the first set of electrical transmission line segments, wherein the second set of electrical transmission line segments and the first set of electrical transmission line segments have a same impedance level.
9. A system comprising: a processing unit electrically coupled to a multi-layer circuit board, wherein the multi-layer circuit board comprises: a layer; a first via passing through the layer; a second via passing through the layer; a first set of electrical transmission line segments at a first area of the layer, wherein the first area is between the first and second vias, and wherein at least one of the first set of electrical transmission line segments has a first thickness; and a second set of electrical transmission line segments on a second area of the layer, wherein the second area is offset to the first area and to the first and second visa, wherein at least one of the second set of electrical transmission line segments has a second thickness that is greater than the first thickness, wherein the first set of electrical transmission line segments is connected to the second set of electrical transmission line segments to form an electrical transmission line, wherein an anti-pad area surrounds the first via, wherein circuitry is prohibited within the anti-pad area, and wherein the first and second thicknesses cause the electrical transmission line to have an average impedance that matches a line impedance of a uniform thickness line, and wherein a connector line connected to the electrical transmission line, wherein the connector line has the line impedance of the uniform thickness line.
10. The system of claim 9 , wherein the first and second sets of electrical transmission line segments together form a single line.
11. The system of claim 9 , wherein the first and second sets of electrical transmission line segments each comprise two lines.
12. The system of claim 11 , wherein both lines in the first set of electrical transmission line segments have the first thickness, and wherein both lines in the second set of electrical transmission line segments have the second thickness.
13. The system of claim 11 , wherein both of the two lines of the electrical transmission line are aligned in a straight line.
14. The system of claim 11 , wherein at least one of the lines from the first set of electrical transmission line segments curves around the anti-pad area.
15. The system of claim 11 , wherein the lines in the second set of electrical transmission line segments are aligned closer together than the lines in the first set of electrical transmission line segments, wherein the second set of electrical transmission line segments and the first set of electrical transmission line segments have a same impedance level.