Method of depositing materials on a non-planar surface
View Patent ↗A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
1. A method of forming a semiconductor device, comprising:
a. providing a semiconductor process chamber having an ingress and an egress, wherein the ingress and egress are operable to allow passage of a carrier carrying at least one non-planar substrate therethrough;
b. moving the carrier through the semiconductor process chamber, wherein moving comprises:
i. rotating the at least one non-planar substrate within the carrier; and
ii. translating the carrier down a translational path through the semiconductor process chamber; and
c. concurrently while moving the carrier through the semiconductor process chamber, performing at least one semiconductor process on the at least one non-planar substrate.
2. The method of claim 1 wherein a path between the ingress and egress is the translational path.
3. The method of claim 1 wherein a rate of rotation is determined as a function of variables from among a list comprised of type and process temperature, deposited material, desired deposition thickness, ambient temperature within the process chamber, quality of a vacuum condition within the process chamber and desired deposition area.
4. The method of claim 1 wherein a rate of translation is determined as a function of variables from among a list comprised of type and process temperature, deposited material, desired deposition thickness, ambient temperature within the process chamber, quality of a vacuum condition within the process chamber and desired deposition area.
5. The method of claim 1 wherein the semiconductor process chamber comprises a deposition chamber.
6. The method of claim 1 wherein the rotation comprises rotating the at least one non-planar substrate about a lengthwise axis.
7. A method of depositing material on a non-planar surface, comprising:
a. providing a deposition chamber having an ingress and an egress, wherein the ingress and egress are operable to allow passage of a carrier carrying at least one non-planar substrate therethrough;
b. moving the carrier down a translational path through the deposition chamber; and
c. rotating the at least one non-planar substrate as the carrier moves down the translational path through the deposition chamber; and,
d. performing at least one semiconductor deposition on the at least one non-planar substrate concurrently with the rotation of the at least one non-planar substrate down the translational path such that at least a portion of the surface area of the at least one non-planar substrate is exposed to the semiconductor deposition.
8. The method of claim 7 wherein a path between the ingress and egress is the translational path.
9. The method of claim 7 wherein a rate of rotation is determined as a function of variables from among a list comprised of type and process temperature, deposited material, desired deposition thickness, ambient temperature within the process chamber, quality of a vacuum condition within the process chamber and desired deposition area.
10. The method of claim 7 wherein a rate of translation is determined as a function of variables from among a list comprised of type and process temperature, deposited material, desired deposition thickness, ambient temperature within the process chamber, quality of a vacuum condition within the process chamber and desired deposition area.
11. The method of claim 7 wherein rotating comprises rotating the at least one non-planar substrate about a lengthwise axis.