Molding method
View Patent ↗A molding method may include forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other, providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either the surface of the substrate or the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern and cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold.
1. A molding method comprising:
forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other;
providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either a surface of the substrate or a surface of the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern;
cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold;
providing a molding material on the solid mold; and
heating the molding material and/or the substrate at a temperature greater than a boiling point of the liquid.
2. The method of claim 1 , wherein providing a molding material on the solid mold includes providing the molding material having a temperature less than the freezing point of the liquid.
3. The method of claim 2 , further comprising:
heating the molding material and the solid mold to cure the molding material and to melt the solid mold into the liquid.
4. The method of claim 3 , further comprising:
discharging the liquid melted from the solid mold through an opening formed in the cured molding material and/or in the substrate.
5. The method of claim 1 , further comprising:
removing the substrate and/or the pattern.
6. The method of claim 1 , wherein a shape of the liquid mold is controlled by adjusting at least one of a viscosity of the liquid, a dipole moment of the liquid, a dipole moment of the surface of the substrate and a dipole moment of the pattern.
7. The method of claim 1 , wherein the surface of the substrate has either a hydrophilic property or a hydrophobic property and the pattern has an opposite property to the property of the surface of the substrate.
8. The method of claim 7 , wherein the liquid is hydrophilic.
9. The method of claim 8 , wherein the hydrophilic liquid is water.
10. The method of claim 2 , wherein the molding material is supplied by spin coating to form a thin film on the solid mold.
11. The method of claim 1 , wherein the pattern is made of a photoresist patterned by photolithography.
12. The method of claim 1 , wherein the liquid is provided by spraying the liquid on the surface of the substrate and on the pattern.
13. The method of claim 1 , wherein the liquid is provided by immersing the substrate in the liquid.
14. A molding method comprising:
forming a hydrophobic pattern on a hydrophilic surface of a substrate;
providing hydrophilic liquid on the hydrophilic surface of the substrate and on the pattern to form a liquid mold on the hydrophilic surface of the substrate;
cooling the liquid mold at a temperature below a freezing point of the hydrophilic liquid to form a solid mold;
providing, on the solid mold and the pattern, a molding material; and
curing the molding material by heating the molding material at a temperature greater than a boiling point of the hydrophilic liquid.
15. The method of claim 14 , further comprising:
providing, on the solid mold and the pattern, the molding material having a temperature less than the freezing point of the hydrophilic liquid.
16. The method of claim 14 , wherein the substrate is made of silicon and the surface of the substrate is processed by thermal oxidation.
17. The method of claim 14 , further comprising:
discharging the hydrophilic liquid melted from the solid mold through an opening formed in the cured molding material and/or in the substrate.
18. The method of claim 15 , wherein the molding material is supplied by spin coating to form a thin film on the solid mold.
19. A molding method comprising:
forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other;
providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either a surface of the substrate or a surface of the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern;
cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold;
providing a molding material on the solid mold; and
heating the substrate and/or the molding material effective to at least partially vaporize the liquid to control a shape of the molding material.
20. The molding method of claim 19 , further comprising forming at least one opening in the substrate and/or the molding material, the at least one opening effective to discharge the liquid.
21. A molding method comprising:
forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other;
providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either a surface of the substrate or a surface of the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern;
cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold;
providing a molding material on the solid mold; and
cooling the substrate and/or the molding material effective to condense the liquid to control the shape of the molding material.
22. The molding method of claim 21 , further comprising forming at least one opening in the substrate and/or the molding material, the at least one opening effective to discharge the liquid.