IP Library Granted Patent US 8,256,288
Granted Patent B2
US 8,256,288 · App. 12/637,792 · Granted Sep 4, 2012

Sensor device

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Quick Facts
Patent No.
US 8,256,288
App. No.
12/637,792
Granted
Sep 4, 2012
Kind
B2
Abstract

A sensor device includes: a sensor component including a package, connection terminals having first terminals on a terminal forming surface of the package, and a sensor element that has a detection axis and is housed in the package; a resin part covering the sensor component; and mounting leads, each of the mounting leads including, a one-end part formed by being folded so as to be coupled to one of the first connection terminals in the resin part so that a main surface of the one-end part and a main surface of the one of the first connection terminals face each other, an intermediate part extending toward a mounting surface of the sensor device from the one-end part, and an other-end part formed by being folded so as to be externally exposed from the resin part. In the device, the sensor component is tilted or orthogonal with respect to the mounting surface, and the connection terminals are provided along one of sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface.

Claims (17)

1. A sensor device, comprising:

a sensor component including:

a package;

connection terminals including first connection terminals on a terminal forming surface of the package; and

a sensor element that has a detection axis and is housed in the package;

a resin part covering the sensor component; and

mounting leads, each of the mounting leads including:

a one-end part formed by being folded so as to be coupled to one of the first connection terminals in the resin part so that a main surface of the one-end part and a main surface of the one of the first connection terminals face each other;

an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and

an other-end part formed by being folded so as to be externally exposed from the resin part,

wherein the sensor component is tilted or orthogonal with respect to the mounting surface, and the connection terminals are provided along one of sides forming an outline of the terminal forming surface, the one of the sides being tilted or orthogonal with respect to the mounting surface.

2. The sensor device according to claim 1 , wherein the terminal forming surface of the sensor component is orthogonal to the mounting surface of the sensor device, and the connection terminals are provided along the one of the sides of the outline of the terminal forming surface, the one of the sides being orthogonal to the mounting surface.

3. The sensor device according to claim 1 , wherein each intermediate part includes an angled part.

4. The sensor device according to claim 1 , wherein a planar shape of the intermediate part is an arch shape.

5. The sensor device according to claim 1 , wherein the other-end parts of the mounting leads are bent to a side of one main surface and a side of the other main surface of the mounting lead.

6. The sensor device according to claim 5 , wherein the other-end parts of the mounting leads adjacent to each other are alternately bent toward the one main surface and the other main surface of the mounting lead.

7. The sensor device according to claim 1 , further comprising test-write leads, wherein the connection terminals include second connection terminals, wherein each of the test-write leads includes: at one-end part coupled to one of the second connection terminal so that a main surface of the one-end part and a main surface of the second connection terminal face each other; an intermediate part that is laid out on the terminal forming surface and externally extended from the resin part so as to straddle a side adjacent to the one of the sides of the terminal forming surface; and an other-end part outwardly exposed from the resin part.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2011
From: EPSON TOYOCOM CORPORATION
To: SEIKO EPSON CORPORATION
Reel/Frame 026808/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2009
From: MATSUNAGA, MASAYUKI
To: EPSON TOYOCOM CORPORATION
Reel/Frame 023652/0316 →