Power electronics substrate for direct substrate cooling
View Patent ↗Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
1. A power inverter module suitable for use in a vehicle comprising:
a power electronics substrate having a first surface and a second surface, the second surface being electrically isolated from the first surface, wherein the second surface is opposite the first surface and includes a plurality of turbulence-inducing features configured to promote turbulence in a fluid in contact with the second surface;
inverter circuitry disposed on the first surface;
a first support frame;
a second support frame defining an exposure region adapted to allow coolant to interface with the second surface of the power electronics substrate; and
a sealing element disposed between the second support frame and the power electronics substrate, the sealing element encompassing the exposure region, wherein:
the first support frame and the second support frame are joined to encapsulate the power electronics substrate;
the sealing element provides a compressive seal about the exposure region when the first support frame and the second support frame are joined; and
the plurality of turbulence-inducing features promote a turbulent boundary layer between the coolant and the power electronics substrate.
2. The power inverter module of claim 1 , wherein the power electronics substrate comprises:
a first layer, the first layer being electrically conductive and having the inverter circuitry disposed thereon;
a second layer, the second layer being thermally conductive and having the plurality of turbulence-inducing features disposed thereon; and
an intermediate layer interposed between the first layer and the second layer, the intermediate layer providing electrical isolation between the first layer and the second layer.
3. The power inverter module of claim 1 , wherein the plurality of turbulence-inducing features are substantially opposite the inverter circuitry.
4. The power inverter module of claim 1 , wherein:
the second surface of the power electronics substrate comprises a first thermally conductive material; and
the turbulence-inducing features are formed from the first thermally conductive material.
5. The power inverter module of claim 1 , wherein the fluid is impinged upon the second surface perpendicular to the second surface.
6. The power inverter module of claim 1 , wherein the first support frame comprises a first injection molded plastic frame and the second support frame comprises a second injection molded plastic frame.
7. The power inverter module of claim 1 , wherein the first support frame includes a cross support opposite the exposure region.
8. The power inverter module of claim 1 , wherein the power electronics substrate comprises a direct bonded copper substrate having an upper copper layer including the inverter circuitry, an intermediate layer comprising a ceramic material, and a lower copper layer including the plurality of turbulence-inducing features.
9. The power inverter module of claim 8 , wherein the lower copper layer is plated with nickel to prevent galvanic mismatch between the lower copper layer and the coolant.
10. An electronics module comprising:
a power electronics substrate having a first surface and a second surface opposite the first surface, wherein the second surface includes a plurality of physical features;
circuitry disposed on the first surface;
a lower support frame adapted to house the power electronics substrate, the lower support frame including one or more openings adapted to allow coolant to impinge upon the second surface of the power electronics substrate, wherein the plurality of physical features inhibit a laminar boundary layer between the coolant and the second surface of the power electronics substrate; and
an upper support frame adapted to house the power electronics substrate, wherein the upper support frame and the lower support frame are joined to encapsulate the power electronics substrate and provide a compressive seal about the one or more openings.
11. The electronics module of claim 10 , wherein the plurality of physical features are symmetrical and uniformly distributed about the second surface of the power electronics substrate.
12. The electronics module of claim 10 , wherein the upper support frame includes cross supports to provide distributed support across the power electronics substrate.
13. The electronics module of claim 10 , wherein the upper and lower support frames each comprise an injection molded plastic frame.
14. The electronics module of claim 10 , further comprising a sealing element disposed between the lower support frame and the power electronics substrate, wherein the sealing element provides the compressive seal when the upper support frame and the lower support frame are joined.