Photonic integrated circuit having a waveguide-grating coupler
View Patent ↗A photonic integrated circuit (PIC) having a waveguide-grating coupler with two evanescently coupled waveguides. The first waveguide is fabricated using materials suitable for manufacturing active optical elements in the PIC. The second waveguide is fabricated using materials capable of providing a relatively high index-of-refraction contrast for the constituent waveguide grating. The waveguide-grating coupler is compatible with the III-V semiconductor technology while being relatively easy to fabricate on an industrial scale.
1. An apparatus, comprising:
a multilayered structure having a substrate layer, a first core layer, a first cladding layer, a second cladding layer, a second core layer, and a third cladding layer, wherein:
the first cladding layer comprises a first material; and
the second cladding layer has a wedge-like portion and comprises a second material different from the first material;
a first optical waveguide having a first core and a first cladding, wherein:
the first core comprises a portion of the first core layer; and
the first cladding comprises a portion of the substrate layer and a portion of the first cladding layer;
a second optical waveguide having a second core and a second cladding, wherein:
the second core comprises a portion of the second core layer; and
the second cladding comprises at least the wedge-like portion of the second cladding layer and a portion of the third cladding layer;
an optical coupler optically coupling the first and second waveguides, wherein the optical coupler comprises a portion of the first cladding layer; and
a waveguide grating being adapted to transfer optical power between one or more waveguide modes of the second waveguide and an optical beam formed by or applied to the waveguide grating, wherein the waveguide grating comprises a portion of the second core layer.
2. The apparatus of claim 1 , wherein an index-of-refraction contrast of the second waveguide is greater than an index-of-refraction contrast of the first waveguide.
3. The apparatus of claim 1 , wherein:
the substrate layer comprises the first material; and
the third cladding layer comprises the second material.
4. The apparatus of claim 3 , wherein:
the first core layer comprises a ternary, quaternary, or quinary group III-V alloy;
the first material comprises a binary group III-V compound;
the second core layer comprises silicon; and
the second material comprises silicon oxide.
5. The apparatus of claim 1 , wherein the optical coupler couples the first and second optical waveguides via evanescent fields.
6. The apparatus of claim 5 , wherein the optical coupler has a length that causes optical energy to spatially beat one or more times between the first and second optical waveguides.
7. The apparatus of claim 1 , wherein a portion of the second cladding layer adjacent to the waveguide grating has a thickness that causes the apparatus to produce constructive interference between (i) light diffracted by the waveguide grating toward an interface between the first cladding layer and the second cladding layer and then reflected back by the interface and (ii) light diffracted by the waveguide grating in a direction collinear with a propagation direction of the reflected light.
8. The apparatus of claim 1 , wherein the first core comprises a laterally tapered portion connected to the optical coupler.
9. The apparatus of claim 1 , further comprising an optical signal-processing (OSP) circuit supported on the substrate layer, wherein the first waveguide is optically coupled to the OSP circuit.
10. The apparatus of claim 9 , wherein the OSP circuit comprises at least one active optical element.
11. The apparatus of claim 9 , wherein the first and second waveguides, the waveguide grating, and the OSP circuit are parts of a photonic integrated circuit (PIC) formed on the substrate layer.
12. The apparatus of claim 1 , wherein:
the first core layer is directly connected to the substrate layer;
the first cladding layer is directly connected to the first core layer;
the second cladding layer is directly connected to the first cladding layer;
the second core layer is directly connected to the second cladding layer; and
the third cladding layer is directly connected to the second core layer.
13. The apparatus of claim 12 , wherein:
a portion of the second core layer is directly connected to the first cladding layer; and
a portion of the third cladding layer is directly connected to the first cladding layer.