Tape-based epitaxial lift off apparatuses and methods
View Patent ↗An apparatus or method for forming a tape-based, epitaxial lift-off film. The epitaxial lift-off film can be for at least one of a solar device, a semiconductor device, and an electronic device. The apparatus can comprise: a tape supply section, the tape supply section providing an unloaded support tape; a lamination section for receiving the unloaded support tape and a plurality of substrates, each substrate containing an epitaxial film thereon, the lamination section adhering the substrates to the unloaded support tape to form a loaded support tape; and an ELO etch section comprising a pressure system for applying pressure on said loaded support tape such that pressure is applied progressively downward and progressively towards a center-line of said loaded support tape when passing through said ELO etch section, the ELO etch section removing the substrates from the loaded support tape, while leaving the epitaxial film on the loaded support tape.
1. An apparatus for forming a tape-based, epitaxial lift-off film for at least one of a solar device, a semiconductor device, and an electronic device, comprising:
a first end;
a second end;
a tape supply section proximate the first end, the tape supply section providing an unloaded support tape;
a lamination section for receiving the unloaded support tape and a plurality of substrates, each substrate containing an epitaxial film thereon, the lamination section adhering the substrates to the unloaded support tape to form a loaded support tape; and
an ELO etch section proximate the second end and comprising a pressure system, wherein the pressure system comprises a static wedge, wherein the static wedge is configured to progressively apply pressure on said loaded support tape such that pressure is applied progressively towards a center-line of said loaded support tape when passing through said ELO etch section, the ELO etch section removing the substrates from the loaded support tape, while leaving the epitaxial film on the loaded support tape.
2. The apparatus of claim 1 , wherein the tape supply section includes at least one roller, the at least one roller having the at least one tape wound thereon.
3. The apparatus of claim 1 , further comprising a splice/punch section between the tape supply section and the lamination section, the splice/punch section forming openings in the at least one unloaded support tape.
4. The apparatus of claim 1 , wherein the ELO etch section is configured to continuously remove the substrates from the at least one loaded support tape.
5. The apparatus of claim 1 , wherein the loaded support tape comprises at least one metal.
6. The apparatus of claim 1 , wherein the loaded support tape comprises at least one material selected from the group consisting of polymeric material, co-polymeric material, oligomeric material, derivatives thereof, and combinations thereof.
7. The apparatus of claim 1 , wherein the loaded support tape moves around at least two reels, drums, or rollers.
8. The apparatus of claim 1 , wherein at least one side of the loaded support tape comprises a row of track openings extending the length of the loaded support tape.
9. The apparatus of claim 1 , wherein the loaded support tape comprises a plurality of slots extending perpendicular or substantially perpendicular from the outside edges of the loaded support tape.
10. The apparatus of claim 1 , wherein the pressure system applies pressure on said loaded support tape such that pressure is applied progressively downward.
11. The apparatus of claim 1 , wherein the static wedge is formed by ramps, wherein the ramps are spaced apart close to the first end and converge towards one another at the second end, extended into the etch bath progressively towards the center-line of the loaded support tape.
12. The apparatus of claim 1 , wherein the static wedge is formed by ramps that extend further down into an etch bath from the first end to the second end.