Method for manufacturing back side illuminaton image sensor

1. A method of manufacturing a back side illumination image sensor, comprising:

forming an ion implantation layer by implanting ions into a front side of a first substrate;

defining a pixel region by forming a device isolation region on the front side of the first substrate;

forming a photosensitive device and a readout circuit on the pixel region;

forming an interlayer dielectric layer and a metal line on the front side of the first substrate over the photosensitive device and the readout circuit;

bonding a second substrate with the front side of the first substrate formed with the metal line;

removing a lower part of the first substrate under the ion implantation layer;

applying wet etching to a back side of the first substrate after removing the lower part of the first substrate; and

forming a microlens on the photosensitive device at the back side of the first substrate.

2. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein the applying of wet etching to the back side of the first substrate is performing wet etching using TMAH (Tetra Methyl Ammonium Hydroxide) liquid.

3. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein the forming of the ion implantation layer is a hydrogen ion implantation or a helium ion implantation.

4. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein the forming of the ion implantation layer forms the ion implantation layer at a uniform depth throughout the front side of the first substrate.

5. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein the removing of the lower part of the first substrate is removing a portion of the first substrate at a side opposite to the front side of the first substrate by applying heat treatment to the ion implantation layer.

6. The method of manufacturing the back side illumination image sensor according to claim 1 , further comprising forming a color filter on the back side of the first substrate after the removing of the lower part of the first substrate.

7. The method of manufacturing the back side illumination image sensor according to claim 1 , further comprising opening a pad formed on the front side of the first substrate after the removing of the lower part of the first substrate under the ion implantation layer.

8. The method of manufacturing the back side illumination image sensor according to claim 7 , wherein the opening of the pad is performing a process of opening the pad to the back side of the first substrate.

9. The method of manufacturing the back side illumination image sensor according to claim 1 , further comprising forming a dielectric layer on the second substrate before the bonding of the second substrate with the front side of the first substrate, such that the dielectric layer contacts and is bonded with the front side of the first substrate.

10. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein defining the pixel region by forming the device isolation region on the front side of the first substrate is performed before the forming of the ion implantation layer.

11. The method of manufacturing the back side illumination image sensor according to claim 1 , wherein the ion implantation layer is formed before defining the pixel region by forming the device isolation region on the front side of the substrate.

12. A method of manufacturing the back side illumination image sensor, comprising:

forming an ion implantation layer by implanting ions into a front side of a first substrate;

forming a photosensitive device and a readout circuit on the front side of the first substrate;

forming an interlayer dielectric layer and a metal line on the front side of the first substrate over the photosensitive device and the readout circuit;

bonding a second substrate with the front side of the first substrate formed with the metal line;

removing a lower part of the first substrate under the ion implantation layer;

applying wet etching to the back side of the first substrate after removing the lower part of the first substrate; and

forming a microlens on the photosensitive device at the back side of the first substrate.

13. The method of manufacturing the back side illumination image sensor according to claim 12 , wherein the applying of wet etching to the back side of the first substrate is performing wet etching using TMAH (Tetra Methyl Ammonium Hydroxide) liquid.

14. The method of manufacturing the back side illumination image sensor according to claim 12 , wherein the forming of the ion implantation layer is forming an ion implantation layer at a uniform depth throughout the front side of the first substrate.

15. The method of manufacturing the back side illumination image sensor according to claim 12 , further comprising opening a pad formed on the front side of the first substrate after the removing of the lower part of the first substrate under the ion implantation layer.

16. The method of manufacturing the back side illumination image sensor according to claim 15 , wherein the opening of the pad is performing a process of opening the pad to the back side of the first substrate.

17. The method of manufacturing the back side illumination image sensor according to claim 12 , further comprising forming a dielectric layer on the second substrate before the bonding of the second substrate with the front side of the first substrate, such that the dielectric layer contacts and is bonded with the front side of the first substrate.

18. The method of manufacturing the back side illumination image sensor according to claim 12 , wherein the forming of the photosensitive device is performed before the forming of the ion implantation layer.

19. The method of manufacturing the back side illumination image sensor according to claim 12 , wherein the ion implantation layer is formed before forming the photosensitive device.