Edge sealing method using barrier coatings
The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
1. A method of forming an edge protection coating over an electronic device, the method comprising:
depositing substantially organic materials, such that an organic region having an edge width between approximately 50 micrometers and approximately 3 millimeters is formed over the electronic device; and
depositing substantially inorganic materials, such that an inorganic region having an edge width between approximately 50 micrometers and approximately 3 millimeters is formed over the electronic device or over the organic region, wherein the edge protection coating comprises the substantially organic materials and the substantially inorganic materials.
2. The method of claim 1 , wherein depositing the substantially inorganic materials between approximately 50 micrometers and approximately 1 millimeter beyond the edge of the electronic device comprises depositing the substantially inorganic materials between approximately 50 micrometers and approximately 1 millimeter beyond the edge of the organic region.
3. The method of claim 1 , the edge protection coating substantially prevents permeation of one or more of water vapor, oxygen, and chemicals to the electronic device in at least the lateral direction.
4. The method of claim 1 , wherein the organic region is approximately 50 nanometers or less in thickness.
5. A method of encapsulating a device, the method comprising:
depositing substantially organic materials over the device to form an organic region having an edge width between approximately 50 micrometers and approximately 1 millimeter from an edge of the device; and
depositing substantially inorganic materials over the organic region to form an inorganic region having an inorganic edge width between approximately 50 micrometers and approximately 1 millimeter from an edge of the organic region, wherein the organic region and the inorganic region form a edge protection coating encapsulating the device.
6. The method of claim 5 , comprising forming an ultra high barrier (UHB) over the edge protection coating, wherein the UHB comprises one or more regions of organic and inorganic materials.
7. The method of claim 5 , comprising using one or more masks to deposit the substantially organic materials and deposit the substantially inorganic materials.