Enhanced plating chemistries and methods for preparation of group IBIIIAVIA thin film solar cell absorbers
View Patent ↗The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through electrodepositing three different films, and then reacting the precursor layer with selenium to form the Group IBIIIAVIA compound layer on the base. The three films, described by the precursor layer, include in one embodiment a first alloy film comprising copper, indium and gallium, a second alloy film comprising copper and selenium formed on the first alloy film; and a selenium film formed on the second alloy film.
1. A method of forming a Group IBIIIAVIA compound layer on a base comprising:
forming a precursor layer on the base, comprising:
electrodepositing a first film on the base using a first electrodeposition solution, the first film comprising a copper-indium-gallium ternary alloy;
electrodepositing a second film on the first film using a second electrodeposition solution, the second film comprising one of a copper-selenium alloy, an indium-selenium alloy and a gallium-selenium alloy; and
electroplating a third film comprising selenium on the second film; and
reacting the precursor layer with selenium thereby forming the Group IBIIIAVIA compound layer on the base.
2. The method of claim 1 , wherein the molar amount of copper in the first film is less than 20%.
3. The method of claim 2 , wherein the second film comprises the copper-selenium alloy and the molar amount of copper in the second film is at least 60%.
4. The method of claim 3 , wherein the second electroplating solution includes a Cu salt and a selenious acid.
5. The method of claim 2 , wherein the first electrodeposition solution includes copper in the range of 0.005 and 0.5 mol/liters, gallium in the range of 0.01 and 0.7 mol/liters and indium in the range of 0.01 and 0.7 mol/liters.
6. The method of claim 5 , wherein the first electrodeposition solution has a pH range of 9-14.
7. The method of claim 6 , wherein the first electrodepositing solution includes a complexing agent selected from one of amine and carboxylic organic complexing agent groups.
8. The method of claim 7 , wherein the complexing agents comprise at least one of citric acid, tartaric acid, ethylenediamine, triethanolamine, glycine, and ethylenediaminetetraacetic acid.
9. The method of claim 5 , wherein the second electrodeposition solution has a pH range of greater than 9.
10. The method of claim 1 wherein electrodepositing the first film comprises,
delivering the first electrodeposition solution to the base;
applying a first electrodeposition potential between an anode and the base to grow a first layer of the first film from the first electrodeposition solution on the base, the molar amount of copper (Cu) in the first layer being higher than the molar amount of indium plus gallium (In+Ga);
applying a second electrodeposition potential to grow a second layer of the first film from the first electrodeposition solution on the first layer; the second layer comprising evenly distributed Cu, indium (In) and gallium (Ga) amounts, wherein the second electrodeposition potential is greater than the first electrodeposition potential; and
applying a third electrodeposition potential to grow a third layer of the first film from the first electrodeposition solution on the second layer; the molar amount of In+Ga in the third layer being higher than the molar amount of Cu, wherein the third electrodeposition potential is greater than the second electrodeposition potential.
11. The method of claim 10 , wherein the molar amount of copper in the first film is less than 20%.
12. The method of claim 11 , wherein the second film comprises the copper-selenium alloy and the molar amount of copper in the second film is at least 60%.
13. The method of claim 12 , wherein the second electroplating solution includes a Cu salt and a selenious acid.
14. The method of claim 11 , wherein the first electrodeposition solution includes copper in the range of 0.005 and 0.5 mol/liters, gallium in the range of 0.01 and 0.7 mol/liters and indium in the range of 0.01 and 0.7 mol/liters.
15. The method of claim 14 , wherein the first electrodeposition solution has a pH range of 9-14.
16. The method of claim 15 , wherein the first electrodepositing solution includes a complexing agent selected from one of amine and carboxylic organic complexing agent groups.
17. The method of claim 16 , wherein the complexing agents comprise at least one of citric acid, tartaric acid, ethylenediamine, triethanolamine, glycine, and ethylenediaminetetraacetic acid.
18. The method of claim 14 , wherein the second electrodeposition solution has a pH range of greater than 9.