IP Library Granted Patent US 8,664,537
Granted Patent B2
US 8,664,537 · App. 12/643,129 · Granted Mar 4, 2014

Method and apparatus for reducing signal noise

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Quick Facts
Patent No.
US 8,664,537
App. No.
12/643,129
Granted
Mar 4, 2014
Kind
B2
Abstract

A printed circuit board having at least two spaced apart conductive planes. A plurality of vias extend between the two spaced apart conductive planes with the vias being electrically connected to a selected one of the two conductive planes in an alternating pattern. A differential electrical signal is connectable to the conductive planes so that the vias are alternately energized by the differential electrical signal when the differential electrical signal is connected to the conductive planes.

Claims (10)

1. An apparatus comprising:

a printed circuit board for carrying circuitry, said printed circuit board including a dielectric substrate having a first conductive plane on a first side of the dielectric substrate and a second conductive plane on a second side of the dielectric substrate, said dielectric substrate maintaining said first conductive plane and said second conductive plane spaced apart;

a plurality of alternately stitched vias located near a portion of an outer periphery of the printed circuit board, each one of said plurality of alternately stitched vias being electrically connected to only one of the first conductive plane and the second conductive plane in an alternating pattern and fully extending between said first conductive plane and said second conductive plane; and

a source having a differential electrical signal connected to said first conductive plane and said second conductive plane so as to have a voltage differential between the first conductive plane and the second conductive plane and alternately energize said plurality of alternately stitched vias and thereby reduce electrical signal noise emissions from the circuitry carried on the printed circuit board.

2. A method for reducing electrical signal noise in an electrical system comprising the steps of:

mounting circuitry to a printed circuit board having a dielectric substrate, a first conductive plane on a first side of the dielectric substrate, and a second conductive plane on a second side of the dielectric substrate, the dielectric substrate maintaining the first conductive plane and the second conductive plane spaced apart;

fully extending a plurality of alternately stitched vias between the first conductive plane and the second conductive plane and near a portion of an outer periphery of the printed circuit board;

electrically connecting the plurality of alternately stitched vias to only one of the first conductive plane and the second conductive plane in an alternating pattern;

providing a source having a differential electrical signal; and

connecting the differential electrical signal provided from the source to the first conductive plane and the second conductive plane so as to have a voltage differential between the first conductive plane and the second conductive plane and alternately energize the plurality of alternately stitched vias and thereby reduce electrical signal noise emissions from the circuitry mounted on the printed circuit board.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2013
From: JPMORGAN CHASE BANK, N.A.
To: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY; TRW INTELLECTUAL PROPERTY CORP.
Reel/Frame 031645/0697 →
SECURITY AGREEMENT Recorded Dec 21, 2012
From: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 029529/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2010
From: MCILQUHAM, KENNETH; PATEL, NIYANT
To: TRW AUTOMOTIVE U.S. LLC
Reel/Frame 023815/0665 →