Silicon thin film solar cell having improved haze and methods of making the same
View Patent ↗A method of increasing the haze of a coating stack having a top layer and an undercoating layer using a chemical vapor deposition coating process includes at least one of: increasing a precursor flow rate; decreasing a carrier gas flow rate; increasing a substrate temperature; increasing a water flow rate; decreasing an exhaust flow rate; and increasing a thickness of at least one of the top layer or undercoating layer.
1. A method of increasing the haze of a coating stack comprising
depositing an undercoating layer using a chemical vapor deposition coating process, wherein the undercoating layer is a single layer having a surface roughness and comprises a mixture of silica, titania and phosphorous oxide;
an oxide of at least one of silicon, titanium, zirconium, tin, and aluminum, depositing a conductive oxide layer over at least a portion of the undercoating layer using the chemical vapor deposition coating process wherein the transparent conductive oxide layer comprises a conductive oxide layer selected from the group consisting of Zn, Fe, Mn, Al, Ce, Sn, Sb, Hf, Zr, Ni, Zn, Bi, Ti, Co, Cr, Si and In and wherein the conductive oxide layer is doped with a dopant selected from the group consisting of F, In, Al, P and Sb and wherein the conductive oxide layer has a surface roughness greater than the surface roughness of the undercoating layer; depositing an amorphous silicon film over at least a portion of the conductive oxide layer and performing at least one coating step to increase the haze of the coating stack selected from the group consisting of increasing a precursor flow rate;
decreasing a carrier gas flow rate; and decreasing an exhaust flow rate.
2. The method of claim 1 , wherein the coated article has a visible light transmittance of greater than 80% and a sheet resistance of less than 15Ω/□.
3. The method of claim 2 , wherein the sheet resistance is less than 10Ω/□.
4. The method of claim 2 , wherein the sheet resistance is in the range of 5Ω/□ to 9Ω/□.
5. The method of claim 1 , including decreasing the exhaust flow rate to result in granular film deposition.
6. The method of claim 1 , wherein the undercoating layer includes anatase titania.
7. The method of claim 1 , wherein the silica is in the range of 30 vol. % to 80 vol. %, the titania is in the range of 5 vol. % to 69 vol. %, and the phosphorous oxide is in the range of 1 vol. % to 15 vol. %.
8. The method of claim 1 , wherein the at least one coating step is decreasing the exhaust flow rate.
9. The method of claim 1 , wherein the at least one coating step is decreasing the carrier gas flow rate.
10. The method of claim 1 , wherein the at least one coating step is increasing the precursor flow rate.
11. The method of claim 1 further comprising a second coating step selected from the group consisting of increasing a precursor flow rate; decreasing the carrier gas flow rate; increasing the water flow rate; and decreasing the exhaust flow rate.
12. The claim of claim 1 , wherein the at least one coating step is decreasing the exhaust flow rate; the method further comprises a second coating step comprising increasing the precursor flow rate, and a third coating step comprising decreasing the carrier gas flow rate.
13. The method of claim 1 , wherein the conductive oxide layer is tin oxide doped with fluorine.
14. The method of claim 1 further comprising depositing a metal containing layer over at least a portion of the amorphous silicon layer.
15. The method of claim 14 wherein the metal containing layer comprises a metal oxide.
16. The method of claim 1 , wherein the conductive oxide layer comprises a surface roughness in the range of 5 nm to 60 nm.