Process and materials for making contained layers and devices made with same

1. A process for forming a contained second layer over a first layer, said process comprising:

forming the first layer having a first surface energy;

treating the first layer with a priming layer;

exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas;

developing the priming layer to effectively remove the priming layer from the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and

forming the second layer by liquid deposition on the pattern of the exposed priming layer on the first layer.

2. The process of claim 1 , wherein developing is carried out by treating with a liquid.

3. The process of claim 1 , wherein developing is carried out by evaporation.

4. The process of claim 1 , wherein developing is carried out by contacting an outermost surface of the unexposed areas with an absorbent surface.

5. The process of claim 1 , wherein developing is carried out by contacting an outermost surface of the unexposed areas with an adhesive surface.

6. A process for making an organic electronic device comprising an electrode having positioned thereover a first organic active layer and a second organic active layer, said process comprising

forming the first organic active layer having a first surface energy over the electrode;

treating the first organic active layer with a priming layer;

exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas;

developing the priming layer to effectively remove the priming layer from the unexposed areas or the unexposed areas resulting in a first active organic layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and

forming the second organic active layer by liquid deposition on the pattern of priming layer on the first organic active layer.

7. The process of claim 6 , wherein the first active layer is a hole transport layer and the second active layer is a emissive layer.

8. The process of claim 6 , wherein the first active layer is a hole injection layer and the second active layer is a hole transport layer.

9. The process of claim 8 , wherein the hole injection layer comprises a conductive polymer and a fluorinated acid polymer.

10. The process of claim 8 , wherein the hole injection layer consists essentially of a conductive polymer doped with a fluorinated acid polymer and inorganic nanoparticles.

11. The process of claim 8 , wherein the priming layer comprises hole transport material.

12. The process of claim 8 , wherein the priming layer comprises a material selected from the group consisting of polymeric triarylamines, polycarbazoles, polyfluorenes, polymeric triarylamines having conjugated moieties which are connected in a non-planar configuration, copolymers of fluorene and triarylamine, metal quinolates, deuterated analogs thereof, and combinations thereof.

13. The process of claim 8 , wherein the hole transport layer is selected from the group consisting of polymeric triarylamines, polymeric triarylamines having conjugated moieties which are connected in a non-planar configuration, and copolymers of fluorene and triarylamines.

14. The process of claim 8 , further comprising forming an emissive layer by liquid deposition on the hole transport layer.