IP Library Granted Patent US 8,264,797
Granted Patent B2
US 8,264,797 · App. 12/643,935 · Granted Sep 11, 2012

Head gimbal assembly having a radial rotary piezoelectric microactuator between a read head and a flexure tongue

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Quick Facts
Patent No.
US 8,264,797
App. No.
12/643,935
Granted
Sep 11, 2012
Kind
B2
Abstract

A novel head gimbal assembly (HGA) includes a piezoelectric microactuator having a first side and an opposing second side. The first side includes a plurality of anchor regions that extend radially from a center point and are bonded to the gimbal tongue. The first side also includes a first plurality of non-bonded regions lying between the anchor regions. The second side includes a plurality of link regions that extend radially from the center point and are bonded to a top surface of the read head. The second side also includes a second plurality of non-bonded regions lying between the link regions. Each of the plurality of link regions is angularly spaced between two of the plurality of anchor regions.

Claims (43)

1. A head gimbal assembly (HGA) comprising:

a read head having an air bearing surface and an opposing top surface;

a load beam;

a flexure attached to the load beam, the flexure including a tongue having a tongue major surface;

a piezoelectric microactuator having a first side and an opposing second side, the first side facing and being generally parallel to the tongue major surface,

wherein the first side comprises

a plurality of anchor regions that extend radially from a center point, each of the plurality of anchor regions being bonded to the tongue, and

a first plurality of non-bonded regions that are not bonded to the tongue, each of the first plurality of non-bonded regions lying between two of the plurality of anchor regions,

and wherein the second side comprises

a plurality of link regions that extend radially from the center point, each of the plurality of link regions being bonded to the top surface of the read head, and

a second plurality of non-bonded regions that are not bonded to the top surface of the read head, each of the second plurality of non-bonded regions lying between two of the plurality of link regions, and

wherein each of the plurality of link regions is angularly spaced between two of the plurality of anchor regions.

2. The HGA of claim 1 wherein each of the plurality of anchor regions is an anchor plateau that protrudes from the first side in a direction that is approximately normal to the tongue major surface.

3. The HGA of claim 2 wherein each of the first plurality of non-bonded regions is recessed from the tongue major surface relative to an adjacent anchor plateau.

4. The HGA of claim 2 wherein each of the anchor plateaus comprises a malleable metal layer and a dielectric layer.

5. The HGA of claim 4 wherein the malleable metal layer comprises gold, and the dielectric layer comprises silicon oxide.

6. The HGA of claim 3 wherein the adjacent anchor plateau protrudes from the first side in a direction that is approximately normal to the tongue major surface, by at least 1 micron to 20 microns relative to at least one of the first plurality of non-bonded regions.

7. The HGA of claim 1 wherein each of the plurality of link regions is a link plateau that protrudes from the second side in a direction that is approximately normal to the read head top surface.

8. The HGA of claim 7 wherein each of the second plurality of non-bonded regions is recessed from the read head top surface relative to an adjacent link plateau.

9. The HGA of claim 7 wherein each of the link plateaus comprises a malleable metal layer and a dielectric layer.

10. The HGA of claim 9 wherein the malleable metal layer comprises gold, and the dielectric layer comprises silicon oxide.

11. The HGA of claim 8 wherein the adjacent link plateaus protrudes from the second side in a direction that is approximately normal to the read head top surface, by at least 1 micron to 20 microns relative to at least one of the second plurality of non-bonded regions.

12. The HGA of claim 1 wherein the piezoelectric microactuator comprises a material selected from the group consisting of: lead zirconate titanate, lanthanum-doped lead zirconate titanate, lead magnesium niobate, lead zinc niobate, barium titanate, zinc oxide, aluminum nitride, strontium bismuth tantalate and strontium bismuth titanate.

13. The HGA of claim 1 wherein the piezoelectric microactuator comprises a laminated construction that includes a plurality of piezoelectric sub-layers, and a plurality of electrically conductive layers, and wherein each of the plurality of piezoelectric sub-layers is separated from another of the plurality of piezoelectric sub-layers by one of the plurality of electrically conductive layers.

14. The HGA of claim 13 wherein each of the plurality of electrically conductive layers is approximately parallel to the tongue major surface.

15. The HGA of claim 13 wherein each of the plurality of piezoelectric sub-layers has a thickness in the range 0.1 micron to 2 microns.

16. The HGA of claim 1 wherein the piezoelectric microactuator has a maximum thickness, measured approximately normal to the tongue major surface, in the range 5 microns to 50 microns.

17. The HGA of claim 1 wherein the plurality of anchor regions comprises at least four anchor regions, and wherein the plurality of link regions comprises at least four link regions, and wherein at least one of the plurality of link regions is angularly spaced between two of the plurality of anchor regions by an average angular spacing of no more than 45 degrees.

18. The HGA of claim 1 wherein the plurality of anchor regions consists of three anchor regions, and wherein the plurality of link regions consists of three link regions, and wherein at least one of the plurality of link regions is angularly spaced between two of the plurality of anchor regions by an average angular spacing of no more than 60 degrees.

19. The HGA of claim 1 further comprising a hole through the piezoelectric microactuator, the hole including the center point.

20. The HGA of claim 19 wherein the hole has a diameter in the range 0.1 mm to 0.5 mm.

21. A head gimbal assembly (HGA) comprising:

a read head having an air bearing surface and an opposing top surface;

a load beam;

a flexure attached to the load beam, the flexure including a tongue having a tongue major surface;

a piezoelectric microactuator having a first side and an opposing second side, the first side facing and being generally parallel to the tongue major surface,

the first side being bonded to the tongue major surface by a plurality of anchor regions that extend radially from a center point, the second side being bonded to the top surface of the read head by a plurality of link regions that extend radially from the center point,

wherein each of the plurality of link regions is angularly spaced between two of the plurality of anchor regions, and

wherein the piezoelectric microactuator comprises a plurality of suspended regions, each of the plurality of suspended regions being suspended between adjacent ones of the plurality of link regions and the plurality of anchor regions, and

wherein each of the plurality of suspended regions does not contact the tongue and does not contact the read head.

22. The HGA of claim 21 further comprising a hole through the piezoelectric microactuator, the hole including the center point.

23. The HGA of claim 21 wherein the piezoelectric microactuator comprises a laminated construction that includes a plurality of piezoelectric sub-layers, and a plurality of electrically conductive layers, and wherein each of the plurality of piezoelectric sub-layers is separated from another of the plurality of piezoelectric sub-layers by one of the plurality of electrically conductive layers.

24. The HGA of claim 21 wherein the plurality of anchor regions consists of two anchor regions, and wherein the plurality of link regions consists of two link regions, and wherein at least one of the two link regions is angularly spaced between the two anchor regions by an average angular spacing of no more than 90 degrees.

Assignments (9)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2009
From: EMLEY, NATHAN C.
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 023687/0469 →