Electronic component cover and arrangement
View Patent ↗An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
1. An electronic component cover, comprising:
a plate having a first region adapted to substantially cover at least one side of a first electronic component;
the plate having a second region comprising a cavity in a surface of the plate adapted to accommodate a second electronic component such that, when positioned in the cavity, an outer surface of the second electronic component is substantially flush with the surface of the plate; and
one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;
wherein the one or more leads are electrically isolated from the plate.
2. The electronic component cover of claim 1 , wherein the first electronic component is a modem and the second electronic component is a memory card or a memory card reader.
3. The electronic component cover of claim 1 , wherein the first electronic component or the second electronic component includes at least one of the following: (1) active circuitry, (2) passive circuitry, (3) an antenna, (4) an electrical or mechanical device, or (5) a power source.
4. The electronic component cover of claim 1 , wherein the plate forms a shield.
5. The electronic component cover of claim 1 , wherein the plate is formed of tin-plated steel.
6. The electronic component cover of claim 1 , wherein the plate is formed of a polymer material and the one or more leads are etched onto the polymer material.
7. The electronic component cover of claim 1 , further comprising:
a non-conductive mount adapted to accommodate the second electronic component thereon;
wherein the nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
8. The electronic component cover of claim 7 , wherein the second electronic component is an antenna embedded in the nonconductive mount.
9. The electronic component cover of claim 7 , wherein the conductive mount is formed of a plastic.
10. An electronic component arrangement, comprising:
a first electronic component adapted to be mounted on a circuit board;
a cover having a first region substantially covering at least one side of the first electronic component, the cover having a second region comprising a cavity in a surface of the cover adapted to accommodate a second electronic component such that, when positioned in the cavity, an outer surface of the second electronic component is substantially flush with the surface of the cover; and
one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;
wherein the one or more leads are electrically isolated from the cover.
11. The electronic component arrangement of claim 10 , wherein the cover is formed of a polymer material and the one or more leads are etched onto the polymer material.
12. The electronic component arrangement of claim 10 , further comprising:
a nonconductive mount adapted to accommodate the second electronic component thereon;
wherein the nonconductive mount secures the one or more leads to the cover while electrically isolating the one or more leads from the cover.
13. The electronic component arrangement of claim 12 , wherein the second electronic component is an antenna embedded in the nonconductive mount.
14. The electronic component arrangement of claim 12 , wherein the nonconductive mount is formed of a plastic.
15. An electronic component arrangement, comprising:
a first electronic component adapted to be mounted on a circuit board;
a cover having a first region substantially covering at least one side of the first electronic component;
a second electronic component positioned in a cavity in a surface of the cover such that an outer surface of the second electronic component is substantially flush with the surface of the cover; and
one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component;
wherein the one or more leads are electrically isolated from the cover.
16. The electronic component arrangement of claim 15 , wherein the cover is formed of a polymer material and the one or more leads are etched onto the polymer material.
17. The electronic component arrangement of claim 15 , further comprising:
a nonconductive mount accommodating the second electronic component thereon;
wherein the nonconductive mount secures the one or more leads to the cover while electrically isolating the one or more leads from the cover.
18. The electronic component arrangement of claim 17 , wherein the second electronic component is an antenna embedded in the nonconductive mount.
19. The electronic component arrangement of claim 17 , wherein the nonconductive mount is formed of a plastic.