Method and system for mounting lasers on energy assisted magnetic recording heads

1. A method for providing a plurality of energy assisted magnetic recording (EAMR) heads including a plurality of EAMR transducers, the method comprising:

aligning a laser bar to the plurality of EAMR heads on a substrate, the laser bar including a plurality of lasers in locations corresponding to a portion of the plurality of EAMR transducers;

bonding the laser bar to the substrate;

removing a portion of the laser bar to separate the plurality of lasers;

separating the substrate into the plurality of EAMR heads.

2. The method of claim 1 further comprising:

enclosing each of the plurality of lasers.

3. The method of claim 2 wherein the enclosing further includes:

bonding a capping layer to the substrate, the capping layer having a laser-facing surface including a plurality of laser cavities therein, the plurality of laser cavities enclosing the plurality of lasers.

4. The method of claim 1 wherein the removing the portion of the laser bar further includes:

dicing the laser bar.

5. The method of claim 4 wherein the removing the portion of the laser bar further includes:

covering the plurality of laser bars with photoresist before the dicing.

6. The method of claim 5 wherein the dicing further includes:

performing laser dicing.

7. The method of claim 5 wherein the dicing further includes:

performing mechanical dicing.

8. The method of claim 1 wherein the removing the portion of the laser bar further includes:

providing a mask including a plurality of lines separated by a plurality of apertures,

the plurality of apertures exposing the portion of the laser bar; and

etching the portion of the laser bar.

9. The method of claim 1 wherein the removing the portion of the laser bar further includes:

thinning the laser bar.

10. The method of claim 1 further comprising:

providing the laser bar from a wafer including a plurality of laser bars.

11. The method of claim 10 wherein the providing the laser bar further includes:

cleaving the wafer to provide the laser bar, the laser bar including a plurality of edges, a top side, and a bottom side;

providing an antireflective coating on at least one of the plurality of edges;

providing a high reflective coating on another of the plurality of edges; and

providing metallization on the bottom side of the laser bar, the bottom side being bonded to the substrate.

12. The method of claim 1 wherein the plurality of lasers are edge emitting lasers.

13. The method of claim 1 wherein the bonding the laser bar further includes:

performing a low-temperature bonding at a temperature of not more than 250 degrees Celsius.

14. The method of claim 13 wherein the temperature is not more than 200 degrees Celsius.

15. The method of claim 1 wherein the aligning further includes:

actively aligning the laser bar.

16. The method of claim 1 wherein the aligning further includes:

passively aligning the laser bar.

17. A method for providing a plurality of energy assisted magnetic recording (EAMR) heads comprising:

providing metallization and at least one alignment mark on a wafer including a plurality of plurality of laser bars, each of the plurality of laser bars including a plurality of lasers, a plurality of edges, a top side, and a bottom side, the metallization and at least one alignment mark residing on the bottom side;

cleaving a wafer to provide the plurality of laser bars providing an antireflective coating on at least one of the plurality of edges of each of the plurality of laser bars;

providing a high reflective coating on at least another of the plurality of edges of each of the plurality of laser bars;

passively aligning each of the plurality of laser bars to a portion of the plurality of EAMR heads on a substrate using the alignment marks, the plurality of lasers in locations corresponding to a portion of the plurality of EAMR transducers;

bonding the bottom of each of the plurality of laser bars to the substrate;

thinning the plurality of laser bars;

removing a portion of the each of the plurality of laser bars to separate the plurality of lasers using at least one of dicing and etching through the plurality of laser bars;

enclosing each of the plurality of lasers; and

separating the substrate into the plurality of EAMR heads.

18. The method of claim 17 further comprising:

actively aligning after the laser bars.