Printed circuit board
View Patent ↗A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
1. A printed circuit board comprising:
a first signal layer;
a second signal layer;
a third signal layer located between the first and second signal layers;
a first ground layer located between the first and third signal layers;
a second ground layer located between the second and third signal layers;
a third ground layer located between the third signal layer and the second ground layer;
a first transmission line located on the first signal layer;
a second transmission line located on the third layer;
a first via passes through the printed circuit board, and electronically coupled to the first and second transmission lines, wherein the first via is isolated from the first, second, and third ground layers; and
a second via passes through the printed circuit board, wherein the second via is electronically coupled to the first and third ground layers, and isolated from the second ground layer.
2. The printed circuit board of claim 1 , further comprising a third via electronic coupled with the first and third ground layers, wherein the third via passes through the printed circuit board, and is isolated from the second ground layer.
3. The printed circuit board of claim 2 , wherein the second and third vias are located on different sides of the first via.