Resin composition
The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10 −3 Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.
1. A resin composition comprising a thermoplastic resin (A), an inorganic compound (B) having a volume resistance of less than about 10 −3 Ω·m and a relative permeability of more than about 5,000 and a fiber filler (C).
2. The resin composition of claim 1 , wherein said resin composition further comprises a carbon filler (D).
3. The resin composition of claim 1 , wherein said resin composition comprises about 40 to about 80% by weight of the thermoplastic resin (A), about 3 to about 20% by weight of the inorganic compound (B) having a volume resistance of less than about 10 −3 Ω·m and a relative permeability of more than about 5,000, and about 5 to about 40% by weight of the fiber filler (C).
4. The resin composition of claim 3 , wherein said resin composition further comprises about 0.05 to about 10.0% by weight of a carbon filler (D).
5. The resin composition of claim 1 , wherein said fiber filler (C) comprises carbon fiber, glass fiber, boron fiber, amide fiber, liquid crystalline polyester fiber, or a combination thereof.
6. The resin composition of claim 2 , wherein said carbon filler (D) comprises a carbon nanotube, carbon black, carbon nanofiber, or a combination thereof.
7. The resin composition of claim 1 , wherein said thermoplastic resin (A) comprises polyamide, polyethylene terephthalate, polybutylene terephthalate, polyacetal, polycarbonate, polyimide, polyphenylene oxide, polysulfone, polyphenylene sulfide, polyamide imide, polyether sulfone, liquid crystalline polymer, polyether ketone, polyether imide, polyolefin, ABS resin, polystyrene, syndiotactic polystyrene, or a combination thereof.
8. The resin composition of claim 1 , wherein said thermoplastic resin (A) is a crystalline thermoplastic resin.
9. The resin composition of claim 1 , wherein said fiber filler (C) has an average diameter of about 1 to about 20 μm and an average length of about 1 to about 15 mm.
10. The resin composition of claim 1 , wherein the fiber filler (C) is a carbon fiber having a volume resistance of less than about 10 −3 Ω·m and a tensile strength of more than about 100 GPa.
11. The resin composition of claim 6 , wherein said carbon nanotube has an average outer diameter of about 1 to about 50 nm and an average length of about 10 nm to about 20 μm.
12. The resin composition of claim 11 , wherein said carbon nanotube comprises a single wall carbon nanotube, a double wall carbon nanotube, a multi wall carbon nanotube, or a combination thereof.
13. The resin composition of claim 1 , wherein said inorganic compound comprises a nickel iron alloy.
14. The resin composition of claim 13 , wherein said nickel iron alloy comprises a mu-metal, a permalloy or a combination thereof.
15. A molded plastic article prepared from the polycarbonate resin composition of claim 1 .
16. The molded plastic article of claim 15 , wherein said molded plastic article has an electromagnetic wave shielding efficiency of about 15 to about 50 dB.
17. The molded plastic article of claim 15 , wherein said molded plastic article has a surface resistance of about 10 to about 10 4 Ω/□ measured according to ASTM D257.
18. The molded plastic article of claim 15 , wherein said molded plastic article has a bending strength of about 12 to about 30 GPa measured according to ASTM D790 with ¼″ width, and a notched izod impact strength of about 25 to about 70 J/m measured according to ASTM D256 with ⅛″ width.