Inkjet printhead nozzle assembly having a raised rim to support an ink meniscus
View Patent ↗A nozzle assembly for an inkjet printhead includes a substrate defining a nozzle chamber and an ink inlet channel in fluid communication with said chamber; a nozzle defined on the substrate and located over the nozzle chamber, said nozzle having a crown portion with a skirt portion depending from the crown portion, the skirt portion forming a first part of a peripheral wall portion of the nozzle chamber, the nozzle surrounded by a raised rim for supporting a meniscus of a body of ink in the nozzle chamber; and an actuator with a connecting arm fast with the nozzle to operatively displace the nozzle towards the substrate. The nozzle is substantially hexagonally shaped.
1. A nozzle assembly for an inkjet printhead, said nozzle assembly comprising:
a substrate defining a nozzle chamber and an ink inlet channel in fluid communication with said chamber;
a nozzle defined on the substrate and located over the nozzle chamber, said nozzle having a crown portion with a skirt portion depending from the crown portion, the skirt portion forming a first part of a peripheral wall portion of the nozzle chamber, the nozzle surrounded by a raised rim for supporting a meniscus of a body of ink in the nozzle chamber; and
an actuator with a connecting arm fast with the nozzle to operatively displace the nozzle towards the substrate, wherein
the nozzle is substantially hexagonally shaped.
2. The nozzle assembly of claim 1 , wherein the substrate includes a silicon wafer on which a dielectric layer is deposited followed by a CMOS passivation layer.
3. The nozzle assembly of claim 1 , further comprising a wall portion defining a second part of the peripheral wall of the nozzle chamber, the second part having an inwardly directed lip for facilitating the formation of surface tension of the meniscus as a seal for inhibiting the escape of ink from the nozzle.
4. The nozzle assembly of claim 1 , wherein the actuator is a thermal bend actuator and is connected to an anchor extending upwardly from the CMOS passivation layer, the anchor mounted on conductive pads which form an electrical connection with the actuator.