IP Library Granted Patent US 7,923,748
Granted Patent B2
US 7,923,748 · App. 12/649,631 · Granted Apr 12, 2011

Integrated LED heat sink

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Quick Facts
Patent No.
US 7,923,748
App. No.
12/649,631
Granted
Apr 12, 2011
Kind
B2
Abstract

A heat sink for use with a high output LED light source is disclosed. The heat sink is used with an LED and conical reflector. The heat sink has a cylindrical back end holding the light emitting diode. The heat sink includes a conically shaped wall having an inner and outer surface and an open front end. The open front end has a rim with notches. The reflector has a front flat surface with arms which are fixed in the notches with a fastener. The heat sink includes a plurality of slits formed on the inner and outer surfaces extending between the back and front ends. A plurality of vanes extend radially from the inner surface. The heat sink is fabricated from a thermally conductive material. The conical shape of the heat sink, the slits and vanes increases exposed surface area to assist in dissipating heat generated from the LED.

Claims (23)

1. A high output light emitting diode light source, the light source comprising:

a light emitting diode mounted to a substrate; and

a heat sink comprising a base member having electrical connections, a wall having a generally conically shaped portion, the conically shaped portion of the wall having an outer surface, an inner surface, a back end having a mounting aperture for the base member, an opposite open front end, a plurality of openings through the conically shaped portion, and a plurality of vanes extending radially inward from the inner surface,

wherein the substrate is attached to the base member.

2. The light source of claim 1 wherein the wall and base member are fabricated from a highly thermally conductive material.

3. The light source of claim 2 wherein the highly thermally conductive material is aluminum.

4. The light source of claim 1 wherein the front end includes a circular rim having a plurality of notches for the mounting of arms attached to a reflector.

5. A high output light emitting diode light source, the light source comprising:

a light emitting diode mounted to a substrate plate; and

a heat sink comprising a wall having a generally conically shaped portion, the conically shaped portion having an open front end, a back end opposite the front end and a plurality of openings through the conically shaped portion, wherein the wall is fabricated of a highly thermally conductive material, and a rectangular box-shaped base member having the substrate plate attached thereto.

6. The light source of claim 5 , wherein the highly thermally conductive material is aluminum.

7. The light source of claim 5 , further comprising a plurality of vanes extending radially inward from an inner surface of the wall.

8. The light source of claim 5 wherein the front end includes a circular rim having a plurality of notches.

9. The light source of claim 5 further comprising a clear reflector placed over the light emitting diode.

10. The light source of claim 5 , wherein the base includes two depressions on opposite sides of the base running the full width of the base, parallel to the plane established by the open front end.

11. A high power light emitting diode lamp comprising:

a light emitting diode mounted to a substrate;

a heat sink comprising a base member having electrical connections, a wall having a generally conically shaped portion, the conically shaped portion of the wall having an outer surface, an inner surface, a back end having a mounting aperture for the base member, an opposite open front end, a plurality of openings through the conically shaped portion, and a plurality of vanes extending radially inward from the inner surface; and

a clear reflector over the light emitting diode and having a conical body with a front surface with a plurality of arms extending from the surface in contact with the front end of the heat sink.

12. A high power light emitting diode lamp comprising:

a light emitting diode mounted to a substrate plate;

a heat sink comprising a wall having a generally conically shaped portion, the conically shaped portion having an open front end, a back end opposite the front end and a plurality of openings through the conically shaped portion, wherein the wall is fabricated of a highly thermally conductive material, and a rectangular box-shaped base member having the substrate plate attached thereto; and

a clear reflector over the light emitting diode and having a conical body with a front surface with a plurality of arms extending from the surface in contact with the front end of the heat sink.

Assignments (16)
SECURITY INTEREST Recorded Aug 12, 2022
From: EXCELITAS TECHNOLOGIES CORP.
To: GOLUB CAPITAL MARKETS LLC, AS COLLATERAL AGENT
Reel/Frame 061164/0582 →
RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 061161/0685 →
RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 061161/0607 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Dec 5, 2017
From: EXCELITAS TECHNOLOGIES CORP.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 044695/0525 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Dec 5, 2017
From: EXCELITAS TECHNOLOGIES CORP.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 044695/0780 →
RELEASE OF FIRST LIEN SECURITY INTEREST IN PATENTS RECORDED AT REEL 031558/FRAME 0873 Recorded Dec 1, 2017
From: UBS AG, STAMFORD BRANCH
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 044621/0082 →
RELEASE OF SECURITY INTEREST Recorded Dec 1, 2017
From: CORTLAND PRODUCTS CORP.
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 044591/0966 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS SECOND LIEN Recorded Sep 15, 2016
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS EXISTING AGENT
To: CORTLAND PRODUCTS CORP., AS SUCCESSOR AGENT
Reel/Frame 040043/0135 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Jan 17, 2014
From: EXCELITAS TECHNOLOGIES CORP.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 032086/0605 →
RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 025814/FRAME 0276 Recorded Nov 12, 2013
From: UBS AG, STAMFORD BRANCH
To: EXCELITAS TECHNOLOGIES CORP. (SUCCESSOR-IN-INTEREST TO PERKINELMER SENSORS, INC., PERKINELMER ILLUMINATION, INC. AND PERKINELMER LED SOLUTIONS, INC.)
Reel/Frame 031626/0852 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Nov 3, 2013
From: EXCELITAS TECHNOLOGIES CORP.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 031558/0873 →
MERGER Recorded Apr 10, 2013
From: EXCELITAS TECHNOLOGIES ILLUMINATION, INC.; EXCELITAS TECHNOLOGIES LED SOLUTIONS, INC.; EXCELITAS TECHNOLOGIES SENSORS, INC.; KAISER SYSTEMS, INC.
To: EXCELITAS TECHNOLOGIES SENSORS, INC.
Reel/Frame 030187/0480 →
MERGER Recorded Apr 10, 2013
From: EXCELITAS TECHNOLOGIES SENSORS, INC.; EXCELITAS TECHNOLOGIES CORP.
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 030187/0661 →
CHANGE OF NAME Recorded Aug 8, 2011
From: PERKINELMER LED SOLUTIONS, INC.
To: EXCELITAS TECHNOLOGIES LED SOLUTIONS, INC.
Reel/Frame 026713/0179 →
SECURITY AGREEMENT Recorded Feb 17, 2011
From: PERKINELMER SENSORS, INC.; PERKINELMER ILLUMINATION, INC.; PERKINELMER LED SOLUTIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 025814/0276 →
CHANGE OF NAME Recorded Oct 5, 2010
From: OPTO TECHNOLOGY INC.
To: PERKINELMER LED SOLUTIONS, INC.
Reel/Frame 025084/0617 →