Manufacturing method of solid-state image pickup device

1. A manufacturing method of a solid-state image pickup device comprising the steps of:

(a) providing a wiring substrate having an upper surface, a lower surface opposite to the upper surface, an opening formed in a planned chip-mounting region on the lower surface, and a plurality of bonding leads formed around the opening on the lower surface;

(b) providing a sensor chip having a main surface, a sensor surface formed on the main surface, a plurality of bump electrodes formed in an outer peripheral portion located around the sensor surface on the main surface, and a back surface opposite to the main surface, the outer peripheral portion having a first region and a second region;

(c) supplying a first sealing material made of a thermosetting resin to a first part of the planned chip-mounting region on the lower surface of the wiring substrate;

(d) after the step (c), mounting the sensor chip on the planned chip-mounting region of the wiring substrate such that the main surface of the sensor chip faces the lower surface of the wiring substrate, the bump electrodes of the sensor chip face the bonding leads of the wiring substrate, respectively, and the sensor surface of the sensor chip is exposed from the opening, and curing the first sealing material;

(e) after the step (d), supplying a second sealing material to a second part of the planned chip-mounting region on the lower surface of the wiring substrate; and

(f) after the step (e), curing the second sealing material,

wherein bump electrodes are arranged in the first region and no bump electrode is arranged in the second region, and

wherein in the step (c), the first sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted in the step (d), and the first sealing material is not supplied to a region planarly overlapped with the second region when the sensor chip is mounted in the step (d),

wherein in the step (e), the second sealing material is supplied to a region planarly overlapped with the second region,

wherein the wiring substrate is a flexible wiring substrate,

wherein, in the step (d), the bump electrodes of the sensor chip are connected to respective bonding leads of the wiring substrate, while heating the sensor chip,

wherein, in the step (d), the bump electrodes of the sensor chip are thermocompression-bonded onto respective bonding leads of the wiring substrate, and

wherein each of the bump electrodes thermocompression-bonded onto the bonding leads in step (d) is surrounded by the first sealing material cured by the heating.

2. The manufacturing method of the solid-state image pickup device according to claim 1 ,

wherein the second sealing material is made of thermosetting resin, and

wherein the second sealing material is heated and cured in the step (f).

3. The manufacturing method of the solid-state image pickup device according to claim 2 ,

wherein a heating temperature of the second sealing material in the step (f) is lower than a temperature at which the sensor chip is heated in the step (d).

4. The manufacturing method of the solid-state image pickup device according to claim 3 ,

wherein a curing temperature of the second sealing material supplied in the step (e) is lower than a curing temperature of the first sealing material supplied in the step (c).

5. The manufacturing method of the solid-state image pickup device according to claim 4 further comprising, after the step (d) and before the step (e), the step of: (d1) fixing a first cover member onto the upper surface of the wiring substrate so as to cover the sensor surface of the sensor chip exposed from the opening of the wiring substrate.

6. The manufacturing method of the solid-state image pickup device according to claim 5 ,

wherein the sensor surface of the sensor chip is separated from an inner wall of the first cover member fixed onto the upper surface of the wiring substrate in the step (d1).

7. The manufacturing method of the solid-state image pickup device according to claim 6 ,

wherein an IR filter is mounted on an upper portion of the first cover member.

8. The manufacturing method of the solid-state image pickup device according to claim 7 ,

wherein each of the plurality of bump electrodes of the sensor chip is a gold stud bump.

9. The manufacturing method of the solid-state image pickup device according to claim 8 ,

wherein the wiring substrate provided in the step (a) has a plurality of external terminals respectively electrically connected to the plurality of bonding leads via a plurality of wirings.

10. The manufacturing method of the solid-state image pickup device according to claim 2 further comprising, after the step (d) and before the step (e), the step of:

(d1) fixing a first cover member onto the upper surface of the wiring substrate so as to cover the sensor surface of the sensor chip exposed from the opening of the wiring substrate.

11. The manufacturing method of the solid-state image pickup device according to claim 10 ,

wherein an IR filter is mounted on an upper portion of the first cover member.

12. The manufacturing method of the solid-state image pickup device according to claim 1 ,

wherein the main surface of the sensor chip provided in the step (b) is a quadrangle having four sides,

wherein, on the main surface of the sensor chip, no bump electrode is formed along at least one of the four sides, and the plurality of bump electrodes are formed along other remaining sides, and

wherein the second region corresponds to a region along the at least one side, and the first region corresponds to a region along other remaining sides.

13. The manufacturing method of the solid-state image pickup device according to claim 1 ,

wherein the main surface of the sensor chip provided in the step (b) is a quadrangle having four sides, and

wherein, on the main surface of the sensor chip, the first region where the bump electrodes are arranged and the second region where no bump electrode is arranged are present along at least one of the four sides.