IP Library Granted Patent US 8,331,589
Granted Patent B2
US 8,331,589 · App. 12/651,457 · Granted Dec 11, 2012

MEMS microphone

Assignees: AAC Acoustic Technologies (Shenzhen) Co., Ltd; American Audio Components Inc.
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Quick Facts
Patent No.
US 8,331,589
App. No.
12/651,457
Granted
Dec 11, 2012
Kind
B2
Abstract

A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity. The housing includes a base and a sidewall extending perpendicularly from the base. A conductive case is provided to cover the cover and the sidewall of the housing. The base defines a periphery portion outside of the cavity for forming a step, and the conductive case locates a bottom end thereof on the step.

Claims (27)

1. A MEMS microphone, comprising:

a cover;

a housing engaging with the cover for forming a cavity, the housing comprising a base and a sidewall extending perpendicularly from the base;

at least one transducer accommodated in the cavity, the transducer having a back volume; and

a conductive case covering the cover and the sidewall of the housing; wherein

the base includes a periphery portion outside of the cavity for forming a step, and a bottom end of the conductive case sits on the step;

and wherein, the cover is a printed circuit board, and the housing includes conductive traces embedded therein for electrically connecting with the cover.

2. The MEMS microphone as described in claim 1 , wherein the cover includes an acoustic hole for receiving acoustic signals.

3. The MEMS microphone as described in claim 2 , wherein the transducer is mounted on the cover and overlaps at least a portion of the acoustic hole.

4. The MEMS microphone as described in claim 2 , wherein the back volume of the transducer communicates with the acoustic hole.

5. The MEMS microphone as described in claim 2 , wherein the conductive case forms an acoustic aperture communicating with the acoustic hole.

6. The MEMS microphone as described in claim 1 , wherein the cover has a recess, and the sidewall of the housing includes a protrusion for engaging with the recess.

7. The MEMS microphone as described in claim 1 , wherein the sidewall of the housing forms a recess, and the cover includes a protrusion for engaging with the recess.

8. The MEMS microphone as described in claim 1 , wherein the cover includes a first group of terminals for electrically connecting with the conductive traces in the housing and a second group of terminals for electrically connecting with the transducer.

9. A MEMS microphone, comprising:

a cover having an acoustic hole;

a housing engaging with the cover for forming a cavity therebetween;

at least one transducer accommodated in the cavity;

a conductive case covering the cover and the housing for forming a shield; wherein

the housing includes a base and a sidewall extending perpendicularly from a portion at a distance from the most periphery portion of the base, and a bottom end of the conductive case sits on the base at a portion located between the most periphery portion and the sidewall; and wherein

the transducer includes a MEMS die and a controlling chip both mounted on the cover, and the MEMS die overlaps at least a portion of the acoustic hole; and wherein

the cover is a printed circuit board, and the housing includes conductive traces embedded therein for electrically connecting with the cover and the controlling chip.

10. The MEMS microphone as described in claim 9 , wherein the conductive case forms an acoustic aperture communicating with the acoustic hole.

11. The MEMS microphone as described in claim 9 , wherein the cover forms a recess, and the sidewall of the housing includes a protrusion for engaging with the recess.

12. The MEMS microphone as described in claim 9 , wherein the sidewall of the housing forms a recess, and the cover includes a protrusion for engaging with the recess.

13. The MEMS microphone as described in claim 9 , wherein the MEMS die forms a back volume communicating with the acoustic hole.

14. The MEMS microphone as described in claim 9 , wherein the cover includes a first group of terminals for electrically connecting with the conductive traces in the housing and a second group of terminals for electrically connecting with the controlling chip.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2017
From: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
To: AAC TECHNOLOGIES PTE. LTD.
Reel/Frame 042319/0113 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 1, 2010
From: WU, ZHI-JIANG; CHEN, XING-FU; SU, YONG-ZE
To: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.; AMERICAN AUDIO COMPONENTS INC.
Reel/Frame 023725/0460 →
Priority Claims (1)
CN 2009 1 0108213 · Jun 19, 2009 · national
Continuity (1)
Related Publication 20100322451A1 · Dec 23, 2010