IP Library Granted Patent US 8,337,065
Granted Patent B2
US 8,337,065 · App. 12/652,126 · Granted Dec 25, 2012

Flexible light-guiding module with waterproof function

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Quick Facts
Patent No.
US 8,337,065
App. No.
12/652,126
Granted
Dec 25, 2012
Kind
B2
Abstract

A flexible light-guiding module with waterproof function includes a flexible light-guiding film, a light-reflecting element and a light-generating element. The light-reflecting element is disposed on a bottom side of the flexible light-guiding film. The light-generating element is embedded into the flexible light-guiding film, and the light-generating element has a circuit substrate and at least one light-generating chip electrically disposed on the circuit substrate. Hence, the light-generating element is embedded into the flexible light-guiding film, so that the light-generating element is waterproof. In addition, the present invention can be attached to any plane or curved surface by using the flexible light-guiding film, so that the application field of the present invention is very extensive. Moreover, the flexible light-guiding film and the light-reflecting element are integrally formed in order to decrease manufacturing cost of the present invention.

Claims (30)

1. A flexible light-guiding module with waterproof function, comprising:

a flexible light-guiding film;

a light-reflecting element disposed on a bottom side of the flexible light-guiding film; and

a light-generating element embedded into the flexible light-guiding film, wherein the light-generating element has a circuit substrate and at least one light-generating chip electrically disposed on the circuit substrate;

wherein the flexible light-guiding film is divided into a first section for receiving the light-generating element and a second section connected to the first section, and the thickness of the first section is larger than the thickness of the second section.

2. The flexible light-guiding module according to claim 1 , wherein the flexible light-guiding film is polycarbonate, acrylic resin or silica gel, and the thickness of the flexible light-guiding film is between 0.05 mm and 5 mm.

3. The flexible light-guiding module according to claim 1 , wherein the light-reflecting element has a plurality of micro light-reflecting structures integrally formed on the bottom side of the flexible light-guiding film and projected outwards.

4. The flexible light-guiding module according to claim 1 , wherein the light-reflecting element has a plurality of micro light-reflecting structures integrally formed on the bottom side of the flexible light-guiding film and concaved inwards.

5. The flexible light-guiding module according to claim 1 , wherein the circuit substrate is a PCB or an FPC, and the at least one light-generating chip is an LED.

6. The flexible light-guiding module according to claim 1 , wherein a bottom of the circuit substrate is disposedly arranged at the bottom side of the flexible light-guiding film for heat dissipation.

7. The flexible light-guiding module according to claim 1 , wherein the flexible light-guiding film has at least one heat-dissipating hole formed under the light-generating element by a stripping process, so that a portion of a bottom of the circuit substrate is communicated with an external through the at least one heat-dissipating hole.

8. The flexible light-guiding module according to claim 1 , wherein the flexible light-guiding film has at least one heat-dissipating hole formed under the light-generating element by a stripping process and at least one heat-dissipating body filled or disposed in the at least one heat-dissipating hole.

9. The flexible light-guiding module according to claim 1 , wherein the light-generating element has a heat-dissipating element disposed on a bottom of the circuit substrate, and the heat-dissipating element is disposedly arranged at the bottom side of the flexible light-guiding film.

10. The flexible light-guiding module according to claim 1 , wherein the light-generating element has a heat-dissipating element disposed on a bottom of the circuit substrate, and the flexible light-guiding film has at least one heat-dissipating hole formed under the light-generating element by a stripping process, so that a portion of a bottom of the heat-dissipating element is communicated with an external through the at least one heat-dissipating hole.

11. The flexible light-guiding module according to claim 1 , wherein the light-generating element has a heat-dissipating element disposed on a bottom of the circuit substrate, the flexible light-guiding film has at least one heat-dissipating hole formed under the light-generating element by a stripping process and at least one heat-dissipating body filled or disposed in the at least one heat-dissipating hole.

12. The flexible light-guiding module according to claim 1 , wherein the flexible light-guiding module is a backlight module installed under a keyboard module, and the flexible light-guiding film is disposed under the keyboard module.

13. A flexible light-guiding module with waterproof function, comprising:

a flexible light-guiding film;

a light-reflecting element disposed on a bottom side of the flexible light-guiding film; and

a light-generating element embedded into the flexible light-guiding film, wherein the light-generating element has a circuit substrate and at least one light-generating chip electrically disposed on the circuit substrate;

wherein a bottom of the circuit substrate is exposedly arranged at the bottom side of the flexible light-guiding film for heat dissipation.

14. The flexible light-guiding module according to claim 13 , wherein the circuit substrate has a heat-dissipating element exposed from the flexible light-guiding film.

15. A flexible light-guiding module with waterproof function, comprising:

a flexible light-guiding film;

a light-reflecting element disposed on a bottom side of the flexible light-guiding film; and

a light-generating element embedded into the flexible light-guiding film, wherein the light-generating element has a circuit substrate and at least one light-generating chip electrically disposed on the circuit substrate;

wherein the flexible light-guiding film has at least one heat-dissipating hole disposed between a bottom of the circuit substrate and the bottom side of the flexible light-guiding film.

16. The flexible light-guiding module according to claim 15 , wherein the circuit substrate has a heat-dissipating element connected to the at least one heat-dissipating hole.

17. The flexible light-guiding module according to claim 15 , wherein the flexible light-guiding film has at least one heat-dissipating body disposed in the at least one heat-dissipating hole.

18. The flexible light-guiding module according to claim 17 , wherein the circuit substrate has a heat-dissipating element connected to the at least one heat-dissipating body.

Assignments (2)
CHANGE OF NAME Recorded May 22, 2013
From: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
Reel/Frame 030471/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2010
From: HUANG, YAO-LUN
To: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.; LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 023733/0068 →