Solid-state imaging device, method of manufacturing the same, and electronic apparatus
View Patent ↗A solid-state imaging device includes: an on-chip color filter having color filter components formed to correspond to pixels; light-shielding members each formed at the boundary of adjacent color filter components; and lenses concave toward a light incident direction, each formed directly below a corresponding one of the color filter components by self-alignment with the light-shielding members as a mask.
1. A solid-state imaging device comprising:
an on-chip color filter having color filter components corresponding to pixels;
light-shielding members each positioned at the boundary of adjacent color filter components;
a first set of lenses concave toward a light incident side of the solid-state imaging device, each positioned to directly correspond to one of the pixels and one of the color filter components by self-alignment with the light-shielding members; and
a frame-shaped first insulating film formed on an object side of the light-shielding members and configured to have a triangular sectional shape, and gapless on-chip microlenses are formed on the on-chip color filter so as to terminate at the apex of the triangular sectional shape.
2. The solid-state imaging device according to claim 1 , further comprising:
a second set of lenses concave toward the light incident side of the solid-state imaging device, each positioned to directly correspond to one of the color filter components by self-alignment.
3. The solid-state imaging device according to claim 1 ,
wherein the first set of lenses are formed by a first insulating film having concave portions surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the concave portions.
4. The solid-state imaging device according to claim 2 ,
wherein the second set of lenses are formed by the frame-shaped first insulating film formed on the object side of the light-shielding members and surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the frame-shaped first insulating film.
5. The solid-state imaging device according to claim 1 ,
wherein the light-shielding members are covered with a light-resistance film.
6. A solid-state imaging device comprising:
an on-chip color filter having color filter components corresponding to pixels;
light-shielding members each positioned at the boundary of adjacent color filter components;
a first set of lenses concave toward a light incident side of the solid-state imaging device, each positioned to directly correspond to one of the pixels and one of the color filter components by self-alignment with respect to a base layer; and
a frame-shaped first insulating film formed on an object side of the light-shielding members and configured to have a triangular sectional shape, and gapless on-chip microlenses are formed on the on-chip color filter so as to terminate at the apex of the triangular sectional shape.
7. The solid-state imaging device according to claim 6 ,
a second set of lenses concave toward a light incident side of the solid-state imaging device, each positioned to directly correspond to one of the color filter components, first lens, and pixels by self-alignment.
8. The solid-state imaging device according to claim 6 ,
wherein the first set of lenses are formed by a first insulating film having concave portions surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the concave portions.
9. The solid-state imaging device according to claim 7 ,
wherein the second set of lenses are formed by the frame-shaped first insulating film formed on the object side of the light-shielding members and surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the frame-shaped first insulating film.
10. The solid-state imaging device according to claim 6 ,
wherein the light-shielding members are covered with a light-resistance film.
11. An electronic apparatus comprising:
a solid-state imaging device;
an optical system guiding incident light to photoelectric converters of the solid-state imaging device; and
a signal processing circuit processing an output signal of the solid-state imaging device, wherein the solid-state imaging device has an on-chip color filter having color filter components corresponding to pixels, light-shielding members each positioned at the boundary of adjacent color filter components,
a first set of lenses concave toward a light incident side of the solid-state imaging device, each positioned to directly correspond to one of the pixels and one of the color filter components by self-alignment, and
a frame-shaped first insulating film formed on an object side of the light-shielding members and configured to have a triangular sectional shape, and gapless on-chip microlenses are formed on the on-chip color filter so as to terminate at the apex of the triangular sectional shape.
12. The electronic apparatus according to claim 11 ,
wherein, in the solid-state imaging device, a second set of lenses concave toward the light incident side of the solid-state imaging device, each positioned to directly correspond to one of the color filter components, first lens, and pixels by self-alignment.
13. The electronic apparatus according to claim 11 ,
wherein the first set of lenses are formed by a first insulating film having concave portions surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the concave portions.
14. The electronic apparatus according to claim 13 ,
wherein the second set of lenses are formed by the frame-shaped first insulating film formed on the object side of the light-shielding members and surrounded by sidewalls inclined at a predetermined angle, and a second insulating film buried in the frame-shaped first insulating film.
15. The electronic apparatus according to claim 11 ,
wherein the light-shielding members are covered with a light-resistance film.