Granted Patent B2

US 8,360,390 · App. 12/657,071 · Granted Jan 29, 2013

Abstract

Claims (13)

1. Apparatus for potting an electronic device, comprising:

an enclosure having a first inner volume with the electronic device disposed therein;

a fill control element disposed within the first inner volume, wherein a second inner volume of the fill control element is fluidly coupled to the first inner volume; and

a sealant disposed within a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, wherein air is trapped within at least a first portion of the second inner volume.

2. The apparatus of claim 1 , wherein the sealant is further disposed within a second portion of the second inner volume.

3. The apparatus of claim 1 , wherein the sealant is at least one of epoxy, polyurethane, or silicone.

4. The apparatus of claim 1 , further comprising a lid disposed atop the enclosure.

5. The apparatus of claim 4 , wherein the lid retains the fill control element against the electronic device.

6. The apparatus of claim 1 , wherein the enclosure is at least partially formed from metal and the fill control element is formed from plastic.

7. The apparatus of claim 1 , wherein the enclosure is formed from plastic and the fill control element is at least partially formed from metal.

8. The apparatus of claim 1 , further comprising at least two leads for coupling the electronic device to a device external to the enclosure.

9. The apparatus of claim 8 , further comprising a lead frame coupled to the at least two leads.

10. The apparatus of claim 1 , further comprising at least one support for maintaining the electronic device spaced apart from the enclosure.

Assignments (8)