IP Library Granted Patent US 7,830,204
Granted Patent B2
US 7,830,204 · App. 12/659,185 · Granted Nov 9, 2010

Semiconductor integrated circuit device

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Quick Facts
Patent No.
US 7,830,204
App. No.
12/659,185
Granted
Nov 9, 2010
Kind
B2
Abstract

A semiconductor integrated circuit device for fast and low power operations, comprising a plurality of circuit blocks of a chip, each of which has a plurality of states with different power consumption values. A power management circuit determines the state of each of the circuit blocks so as not to exceed a maximum power consumption value of the semiconductor integrated circuit device by considering the power consumption of each circuit block and by each state transition in each circuit block. The maximum power consumption value may be preset or adjustable after fabrication.

Claims (11)

1. A semiconductor integrated circuit device comprising:

a plurality of first circuit blocks, each of the plurality of circuit blocks having operating states which include a first state and a second state;

a power management block including a memory which stores a maximum chip power value that is referred when the operating state for each of the plurality of circuit block is determined; and

a second circuit block to be privileged to access each of the plurality of first circuit blocks and issue a request signal which requests to raise a number of the first circuit blocks in the first state to the power management block, wherein each of the plurality of first circuit blocks in the first state are activated by higher operational frequency than each of the plurality of the first circuit blocks in the second state, and

wherein if the power management block receives the request signal from the second circuit block when a power consumption of the semiconductor integrated circuit device is lower than the maximum chip power value, the power management block determines to increase the number of the first blocks in the first state under a condition that the power consumption of the semiconductor integrated circuit device is not to exceed the maximum chip power value.

2. A semiconductor integrated circuit device according to claim 1 ,

wherein the maximum chip power value is decided according to a temperature of the semiconductor integrated circuit device.

3. A semiconductor integrated circuit device according to claim 1 ,

wherein the maximum chip power value is decided according to the operating states of the plurality of first circuit blocks.

4. A semiconductor integrated circuit device according to claim 1 ,

wherein the maximum chip power value is decided according to the power consumption of the semiconductor integrated circuit device.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 053654 FRAME: 0254. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED ON REEL 052853 FRAME 0153. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
Reel/Frame 053654/0254 →
PATENT SECURITY AGREEMENT Recorded Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC; INNOVATIVE DISPLAY TECHNOLOGIES LLC; LIFEPORT SCIENCES LLC; LIMESTONE MEMORY SYSTEMS LLC; MERTON ACQUISITION HOLDCO LLC; MOBILE ENHANCEMENT SOLUTIONS LLC; MONARCH NETWORKING SOLUTIONS LLC; NEXUS DISPLAY TECHNOLOGIES LLC; PARTHENON UNIFIED MEMORY ARCHITECTURE LLC; R2 SOLUTIONS LLC; SAINT LAWRENCE COMMUNICATIONS LLC; STINGRAY IP SOLUTIONS LLC; SUPER INTERCONNECT TECHNOLOGIES LLC; TELECONFERENCE SYSTEMS LLC; UNIFICATION TECHNOLOGIES LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2010
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 024952/0049 →
MERGER Recorded Jul 7, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024662/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2010
From: MIZUNO, HIROYUKI
To: HITACHI, LTD.
Reel/Frame 024073/0554 →