Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method
View Patent ↗Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24 , the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.
1. A sealing method comprising:
bringing a first film-forming compound comprising at a first end of the compound a first functional group configured to form a covalent bond with an adhesive, and at a second end of the compound a first surface bonding group, into contact with a first bonding surface of a first adherent to covalently bond the first surface bonding group to a surface functional group of the first bonding surface to form a film of the first film-forming compound on the first bonding surface;
bringing a second film-forming compound comprising at a first end of the compound a second functional group configured to form a covalent bond to the adhesive, and at a second end of the compound a second surface bonding group, into contact with a second bonding surface of a second adherent to covalently bond the second surface bonding group to a surface functional group of the second bonding surface to form a film of the second film-forming compound on the second bonding surface; and
contacting under pressure the first functional group with the adhesive to form a covalent bond between the first functional group and the adhesive, and the second functional group with the adhesive to form a covalent bond between the second functional group and the adhesive.
2. The sealing method according to claim 1 , wherein the first and second functional groups are amino groups or imino groups, and the adhesive comprises an epoxy group.
3. The sealing method according to claim 1 , the first and second surface bonding groups are alkoxysilyl groups.
4. The sealing method according to claim 1 , wherein the first adherent has a coefficient of linear expansion that is greater than a coefficient of linear expansion of the second adherent and during the contacting a temperature of the first adherent is lower than a temperature of the second adherent.
5. The sealing method according to claim 1 , wherein the film of the first film-forming compound is a monomolecular film, and the film of the second film-forming compound is a monomolecular film.