Conductive paste and method for manufacturing the same, wiring using the conductive paste and method for manufacturing the same
View Patent ↗The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.
1. A conductive paste comprising:
a first fine metal particle covered by a first organic thin film formed by reaction of the first fine metal particle with a diacetylene that is
HC≡C—C≡C(CH 2 ) 15 SiCl 3 ; HC≡C—C≡C(CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 ;
HC≡C—C≡C(CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 ;
CH 3 (CH 2 ) 3 C≡C—C≡C(CH 2 ) 15 SiCl 3 ;
CH 3 (CH 2 ) 3 C≡C—C≡C(CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 15 SiCl 3 ; or
CH 3 (CH 2 ) 3 C≡C—C≡C(CH 2 ) 2 Si(CH 3 ) 2 (CH 2 ) 9 SiCl 3 ; and
a second fine metal particle covered by a second organic thin film covalently bound to the surface of the second fine metal particle, the second organic thin film comprising molecules that include a chalcone at a first end and covalently bind to a surface of the second fine metal particle via Si or S at a second end.
2. The conductive paste of claim 1 , wherein the first organic thin film is a monomolecular film that is covalently bound to the surface of the first fine metal particle and the second organic thin film is a monomolecular film that is covalently bound to the surface of the second fine metal particle.
3. A method for manufacturing a wiring comprising: applying the conductive paste of claim 1 to the surface of a base material; and hardening the paste to form the wiring.
4. An electronic component comprising the conductive paste of claim 1 .
5. An electronic device comprising the conductive paste of claim 1 .