Thermoset dampener material
View Patent ↗Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 1500 C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 400 C., each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.
1. A process for dampening vibrations in an article, comprising:
(a) disposing a thermoset composition on a substrate of the article to form a composite; the
thermoset composition having:
a glass transition temperature of 150° C. or greater,
a tan δ peak of 0.2 or greater, and
a tan δ peak width measured at half-height larger than about 40° C.,
each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz; and
(b) exposing the composite to vibrations at temperatures of 100° C. or greater.
2. The process of claim 1 , further comprising:
(c) curing a curable composition to form the thermoset composition on the substrate of the article to form the composite;
wherein the curable composition comprises:
at least one thermosetting resin; and
a hardener.
3. The process of claim 2 , comprising admixing the at least one thermosetting resin and the hardener to form the curable composition.
4. The process of claim 3 , further comprising admixing at least one of a catalyst, an inorganic filler, a fibrous reinforcement, a high temperature resistant thermoplastic resin, a solvent, and an additive to form the curable composition.
5. The process of claim 4 , wherein the high temperature resistant thermoplastic resin is selected from the group consisting of polyetherimides, a polyphenylene ether, a polyoxyphenylene, a polysulphone, a syndiotactic polystyrene, a polyaryl ether ketone, a polycarbonate, an acetal, a polyimide, and a polyarylene sulfide.
6. The process of claim 2 , wherein the thermosetting resin is selected from the group consisting of an epoxy resin, a phenolic resin, a vinylic resin, and a cyanate ester-based resin.