Device having electronic components mounted therein and method for manufacturing such device

1. A device having electronic components mounted therein comprising:

a first electronic component having an external terminal(s) on a first surface and a heat spreader on a second surface;

at least one second electronic component that is located in the direction of said second surface of said first electronic component;

a flexible circuit board that is electrically connected to said external terminal of said first electronic component and at least one said second electronic component, at least a part of said flexible circuit to which at least one said second electronic component is connected being located on said second surface side of said first electronic component; and

a spacer that prevents direct heat transfer between at least part of said flexible circuit board and said second surface of said first electronic component.

2. The device having electronic components mounted therein of claim 1 , wherein

said spacer provides a specified space between at least said part of said flexible circuit board and said second surface of said first electronic component.

3. The device having electronic components mounted therein of claim 1 , wherein

said spacer is secured to a portion of said second surface of said first electronic component other than the surface of said heat spreader.

4. The device having electronic components mounted therein of claim 1 , wherein

a portion of said spacer on which at least said one second electronic component is installed extends through a specified space between the portion of said spacer and said heat spreader so that the portion of said spacer does not come in contact with said heat spreader.

5. The device having electronic components mounted therein of claim 4 , wherein

said spacer has a shape such that said spacer covers said second surface of said first electronic component in an area other than the area where the heat sink is mounted on said heat spreader, and

said spacer and first electronic component form an opening for allowing air in said space to circulate.

6. The device having electronic components mounted therein of claim 1 , wherein

said spacer is formed from at least one of glass, a resin and ceramic.

7. The device having electronic components mounted therein of claim 1 , wherein

said spacer has a thermal conductivity of 1 W/mK or less.

8. The device having electronic components mounted therein of claim 1 , wherein

said first electronic component and said second electronic component are connected to different surfaces of said flexible circuit board.

9. The device having electronic components mounted therein of claim 1 , wherein

said spacer has a concave section or groove section, and

at least one said second electronic component is accommodated inside said concave section or groove section.

10. The device having electronic components mounted therein of claim 9 , wherein

at least one said second electronic component does not come in contact with said spacer.

11. The device having electronic components mounted therein of claim 9 , wherein

said first electronic component and said second electronic component are connected on the same surface of said flexible circuit board.

12. The device having electronic components mounted therein of claim 1 , wherein

said first electronic component is an electronic component that includes a semiconductor element, and

at least one said second electronic component is an electronic component that includes a semiconductor element or is a passive element.

13. The device having electronic components mounted therein of claim 1 , wherein

said flexible circuit board is adhered to at least one of said first electronic component and said spacer with an adhesive, and

said adhesive is a thermoplastic resin or a thermal setting resin before setting.

14. A manufacturing method for a device having electronic components mounted therein comprising:

installing a spacer on a second surface of a first electronic component which has an external terminal(s) on a first surface and a heat spreader on said second surface, said spacer preventing direct heat transfer between at least a part of a flexible circuit board that is located above said second surface and said second surface;

electrically connecting said external terminal and said flexible circuit board, and bending said flexible circuit board such that part of said flexible circuit board is located above said spacer; and

electrically connecting a second electronic component to the portion of said flexible circuit board that is above said spacer.

15. A manufacturing method for a device having electronic components mounted therein comprising:

installing a spacer on a second surface of a first electronic component, which has an external terminal(s) on a first surface and a heat spreader on said second surface, said spacer preventing direct heat transfer between at least a part of a flexible circuit board that is located above said second surface and said second surface;

electrically connecting said external terminals and said flexible circuit board, and electrically connecting a second electronic component and said flexible circuit board; and

bending said flexible circuit board such that said second electronic component is located above said spacer.