Workpiece processing system and method
A workpiece processing system and method, the workpiece processing system comprising at least one workpiece processing module ( 3 ), each workpiece processing module comprising: a workpiece processing unit ( 11 ) for processing workpieces (W); and a feed unit ( 37 ) which is operable to transfer workpieces to and from the workpiece processing unit, wherein the feed unit comprises input and output feed assemblies ( 38, 39 ) which are operable to transfer workpieces to and from the workpiece processing unit and a processing zone feed assembly ( 40 ) which interconnects the input and output feed assemblies and is operable to transfer workpieces from the input feed assembly ( 38 ) to the workpiece processing unit and from the workpiece processing unit to the output feed assembly ( 39 ).
1. A workpiece processing system comprising a plurality of workpiece processing modules, each comprising a workpiece processing unit for processing workpieces and a feed unit for transferring workpieces to and from the workpiece processing unit, wherein the feed units together provide at least one common output workpiece feed along which workpieces are transferred from the workpiece processing units of each of the workpiece processing modules.
2. The workpiece processing system of claim 1 , comprising at least three workpiece processing modules.
3. The workpiece processing system of claim 1 , wherein the workpiece processing modules comprise print modules.
4. The workpiece processing system of claim 1 , wherein at least one of the workpiece processing modules has a different function.
5. The workpiece processing system of claim 4 , wherein at least one workpiece processing module comprises a printer and at least one workpiece processing module comprises a ball placer.
6. The workpiece processing system of claim 5 , wherein at least one workpiece processing module comprises a printer and a plurality of workpiece processing modules comprise ball placers.
7. The workpiece processing system of claim 1 , comprising an inverting device for inverting a workpiece, whereby ones of the workpiece processing modules provide for operation on different sides of the workpieces.
8. The workpiece processing system of claim 1 , wherein the feed unit comprises input and output feed assemblies for transferring workpieces to and from the workpiece processing unit and a processing zone feed assembly which interconnects the input and output feed assemblies for transferring workpieces from the input feed assembly to the workpiece processing unit and from the workpiece processing unit to the output feed assembly.
9. The workpiece processing system of claim 8 , wherein the workpiece processing modules are disposed in parallel relation, such that respective ones of the input and output feed assemblies of the modules are connected together and define infeed and outfeed lines, and each module is separately operable to process workpieces.
10. The workpiece processing system of claim 8 , comprising a single input workpiece feed.
11. The workpiece processing system of claim 8 , comprising a single output workpiece feed.
12. The workpiece processing system of claim 8 , comprising at least two input workpiece feeds.
13. The workpiece processing system of claim 8 , comprising at least two output workpiece feeds.
14. A method of processing workpieces using the workpiece processing system of claim 1 .
15. The workpiece processing system of claim 1 , wherein the workpiece processing modules comprise print modules.
16. The workpiece processing system of claim 15 , comprising a hot-melt processing system for printing on wafers.
17. The workpiece processing system of claim 16 , comprising three workpiece printing modules, wherein first and second of the printing modules provide for hot-melt printing on workpieces, and an inverting device for inverting workpieces between the first and second printing modules.
18. A method of processing workpieces, comprising the steps of:
providing a plurality of workpiece processing modules, each comprising a workpiece processing unit for processing workpieces and a feed unit for transferring workpieces to and from the processing unit, wherein the feed units together provide at least one common workpiece feed along which workpieces are transferred from the workpiece processing units of each of the workpiece processing modules; and
transferring workpieces to and from the workpiece processing units and along the at least one common output workpiece feed.
19. The method of claim 18 , wherein the workpiece processing modules comprise print modules.
20. The method of claim 19 , wherein the method is for hot-melt processing on wafers.
21. The method of claim 20 , comprising three workpiece printing modules, wherein first and second of the printing modules provide for hot-melt printing on workpieces, and further the steps of:
transferring workpieces in series between the workpiece printing modules; and
inverting workpieces between the first and second printing modules.
22. The method of claim 18 , wherein at least one of the workpiece processing modules has a different function.
23. The method of claim 22 , wherein the method is a method of ball placement, and at least one workpiece processing module comprises a printer and at least one workpiece processing module comprises a ball placer.
24. The method of claim 23 , wherein at least one workpiece processing module comprises a printer and a plurality of workpiece processing modules comprise ball placers.
25. The method of claim 18 , further comprising the step of:
inverting the workpieces and operating on different sides of the workpieces.
26. The method of claim 18 , wherein the feed unit comprises input and output feed assemblies for transferring workpieces to and from the workpiece processing unit and a processing zone feed assembly which interconnects the input and output feed assemblies for transferring workpieces from the input feed assembly to the workpiece processing unit and from the workpiece processing unit to the output feed assembly.
27. The method of claim 26 , comprising a single input workpiece feed.
28. The method of claim 26 , comprising a single output workpiece feed.
29. The method of claim 26 , comprising at least two input workpiece feeds.
30. The method of claim 26 , comprising at least two output workpiece feeds.
31. The method of claim 18 , wherein the workpiece processing modules are disposed in parallel relation, and respective ones of the input and output feed assemblies of the modules are connected together and define infeed and outfeed lines.
32. The method of claim 18 , comprising at least three workpiece processing modules.