Optical device, method of producing the device and optoelectronic component comprising the device
View Patent ↗An optical device having a specific form is provided that includes a resin molding compound having an adhesion-reducing, chemically modified surface layer.
1. An optical device, comprising a resin molding compound which has a chemically modified, adhesion-reducing surface layer, wherein the surface layer is formed of the same resin molding compound as the device, the resin molding compound of the surface layer being chemically modified.
2. The device according to claim 1 , wherein the surface layer comprises a fluorinated layer.
3. The device according to claim 1 , wherein the surface layer is adhesion-reducing for dust particles.
4. The device according to claim 1 , wherein the device is transparent or reflecting for radiation.
5. The device according to claim 1 , wherein the molding compound comprises a potting material.
6. The device according to claim 1 , wherein the molding compound forms a lens.
7. The device according to claim 1 , wherein the resin molding compound comprises a material selected from the group consisting of silicone resin, epoxy resin and hybrid resin that has silicone groups and/or epoxy groups.
8. A method of producing an optical device, the method comprising:
providing a resin molding compound;
forming the resin molding compound into an optical device; and
producing an adhesion-reducing surface layer on the optical device, wherein the surface layer is formed of the same resin molding compound as the device, and wherein producing the adhesion-reducing surface layer comprises chemically modifying the surface layer of the resin molding compound.
9. The method according to claim 8 , wherein forming the resin molding compound into an optical device comprises forming a lens.
10. The method according to claim 8 , wherein chemically modifying the resin molding compound comprises exposing the surface layer to a plasma that comprises fluorine-containing compounds.
11. An optoelectronic component comprising:
a radiation-emitting or radiation-receiving semiconductor layer sequence; and
an optical device located in a beam path of the radiation-emitting or radiation-receiving semiconductor layer sequence, the optical device comprising a resin molding compound which has a chemically modified, adhesion-reducing surface layer, wherein the optical device comprises a potting.
12. The optoelectronic component according to claim 11 , wherein the surface layer comprises a fluorinated surface layer.
13. The optoelectronic component according to claim 11 , wherein the resin molding compound comprises a material selected from the group consisting of silicone resin, epoxy resin and hybrid resin that has silicone groups and/or epoxy groups.
14. The optoelectronic component according to claim 11 , wherein the radiation-emitting or radiation-receiving semiconductor layer sequence comprises a radiation-emitting semiconductor layer sequence.
15. The optoelectronic component according to claim 11 , wherein the radiation-emitting or radiation-receiving semiconductor layer sequence comprises a radiation-receiving semiconductor layer sequence.
16. A method of producing an optical device, the method comprising:
providing a resin molding compound;
forming the resin molding compound into an optical device, wherein forming the resin molding compound into an optical device comprises forming a potting; and
producing an adhesion-reducing surface layer of the resin molding compound on the optical device.
17. An optical device, comprising a resin molding compound which has a chemically modified, adhesion-reducing surface layer, wherein the molding compound comprises a potting material.
18. A method of producing an optical device, the method comprising:
providing a resin molding compound;
forming the resin molding compound into an optical device; and
producing an adhesion-reducing surface layer on the optical device, wherein producing the adhesion-reducing surface layer comprises chemically modifying the surface layer of the resin molding compound, and wherein chemically modifying the resin molding compound comprises exposing the surface layer to a plasma that comprises fluorine-containing compounds.