Current control element, memory element, and fabrication method thereof
View Patent ↗A memory element ( 3 ) arranged in matrix in a memory device and including a resistance variable element ( 1 ) which switches its electrical resistance value in response to a positive or negative electrical pulse applied thereto and retains the switched electrical resistance value; and a current control element ( 2 ) for controlling a current flowing when the electrical pulse is applied to the resistance variable element ( 1 ); wherein the current control element ( 2 ) includes a first electrode; a second electrode; and a current control layer sandwiched between the first electrode and the second electrode; and wherein the current control layer comprises SiN x , and at least one of the first electrode and the second electrode comprises α-tungsten.
1. A current control element for controlling a current flowing when a positive or negative electrical pulse is applied, comprising:
a first electrode;
a current control layer; and
a second electrode;
wherein the current control layer comprises SiN x (0<x≦0.85), and at least one of the first electrode and the second electrode comprises α-tungsten.
2. The current control element according to claim 1 , wherein x of SiN x satisfies 0.3≦x≦0.6.
3. A method of fabricating a current control element including the steps of forming a first electrode; forming a current control layer comprising SiN x (0<x≦0.85), and forming a second electrode, the current control element being configured to control a current flowing when a positive or negative electrical pulse is applied, the method comprising the steps of:
forming at least one of the first electrode and the second electrode using α-tungsten, wherein
the step of forming the current control layer includes a step of sputtering using a target comprising a polycrystalline silicon under a nitrogen-containing atmosphere.
4. The method of fabricating the current control element according to claim 3 , wherein the step of forming α-tungsten includes a step of sputtering using a target comprising tungsten, in an argon-containing atmosphere in which a pressure is 0.8 Pa or lower.
5. A memory element comprising:
a resistance variable element which switches its electrical resistance value in response to a positive or negative electrical pulse applied thereto and retains the switched electrical resistance value; and
a current control element for controlling a current flowing when the electrical pulse is applied to the resistance variable element;
wherein the current control element includes a first electrode; a second electrode; and a current control layer sandwiched between the first electrode and the second electrode; and wherein the current control layer comprises SiN x (0<x≦0.85), and at least one of the first electrode and the second electrode comprises α-tungsten.
6. The memory element according to claim 5 , wherein x of SiN x satisfies 0.3≦x ≦0.6.
7. A method of fabricating a memory element comprising the steps of:
forming a resistance variable element which switches its electrical resistance value in response to a positive or negative electrical pulse applied thereto and retains the switched electrical resistance value; and
forming a current control element for controlling a current flowing when the electrical pulse is applied to the resistance variable element; wherein
the step of forming the current control element includes a step of forming a first electrode, a step of forming a current control layer comprising SiN x (0<x ≦0.85), and a step of forming a second electrode, the method further comprising:
forming at least one of the first electrode and the second electrode with α-tungsten; wherein
the step of forming the current control layer includes a step of sputtering using a target comprising polycrystalline silicon in a nitrogen-containing atmosphere.
8. The method of fabricating the memory element according to claim 7 , wherein x of SiNx satisfies 0.3≦x≦0.6.
9. The method of fabricating the memory element according to claim 7 , wherein the step of forming α-tungsten includes a step of sputtering using a target comprising tungsten in an argon-containing atmosphere in which a pressure is 0.8 Pa or lower.
10. The method of fabricating the memory element according to claim 7 , wherein the step of forming α-tungsten includes a step of depositing α-tungsten by CVD.
11. A memory device comprising:
plural memory elements each of which includes:
a resistance variable element which switches its electrical resistance value in response to a positive or negative electrical pulse applied thereto and retains the switched electrical resistance value; and
a current control element for controlling a current flowing when the electrical pulse is applied to the resistance variable element;
wherein the current control element includes a first electrode; a second electrode; and a current control layer sandwiched between the first electrode and the second electrode; and wherein the current control layer comprises SiN x (0<x≦0.85), and at least one of the first electrode and the second electrode comprises α-tungsten; and
plural bit lines: and
plural word lines which three-dimensionally cross the plural bit lines, respectively; wherein
each of the plural memory elements includes a series circuit including the resistance variable element and the current control element; and wherein
each of the plural memory elements is provided at a section where associated one of the bit lines and associated one of the word lines three-dimensionally cross each other, and in each section, one end of the series circuit is connected to associated one of the bit lines and the other end of the series circuit is connected to associated one of the word lines.
12. The memory device according to claim 11 , wherein x of SiN x satisfies 0.3≦x≦0.6.