Inspection apparatus and inspection method

1. An inspection apparatus which detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an adhesive which contains conductive particles, said inspection apparatus comprising:

a camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component;

an obtaining unit configured to obtain, from the image captured by said camera, a position of a feature point of the panel recognition mark and a position of a feature point of the component recognition mark;

a calculation unit configured to calculate an amount of misalignment of the feature point of one of the panel recognition mark and the component recognition mark in the image from a predetermined position that is determined using the position of the feature point of the other one of the recognition marks as a reference;

a determination unit configured to determine whether or not the feature point of the panel recognition mark and the feature point of the component recognition mark are recognizable in the image; and

a correction unit configured to correct the image when said determination unit determines that the feature points are not recognizable,

wherein said obtaining unit is configured to obtain the positions of the feature points from either the image for which said determination unit has determined that the feature points are recognizable or the image corrected by said correction unit, and

when said determination unit determines that the feature points are not recognizable, said correction unit is configured to delete the conductive particles from the image and perform either linear interpolation or curve interpolation of a part of the image from which the conductive particles have been deleted.

2. An inspection method for detecting an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an adhesive which contains conductive particles, said inspection method comprising:

capturing, by a camera, an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component;

obtaining, from the image captured by the camera, a position of a feature point of the panel recognition mark and a position of a feature point of the component recognition mark;

calculating an amount of misalignment of the feature point of one of the panel recognition mark and the component recognition mark in the image from a predetermined position that is determined using the position of the feature point of the other one of the recognition marks as a reference;

determining whether or not the feature point of the panel recognition mark and the feature point of the component recognition mark are recognizable in the image; and

correcting the image when it is determined in said determining that the feature points are not recognizable,

wherein in said obtaining, the positions of the feature points are obtained from either the image for which it has been determined in said determining that the feature points are recognizable or the image corrected in said correcting, and

in said correcting, the conductive particles are deleted from the image, and either linear interpolation or curve interpolation of a part of the image from which the conductive particles have been deleted is performed when it is determined in said determining that the feature points are not recognizable.

3. A component mounting system comprising:

a mounting apparatus which mounts a component on a panel; and

an inspection apparatus which detects an amount of misalignment, from a predetermined mounting position, of the component mounted on a surface of the panel through an adhesive which contains conductive particles,

wherein said component mounting system corrects, based on the amount of misalignment, a mounting position of the component mounted by said mounting apparatus, and

said inspection apparatus includes:

a camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component;

an obtaining unit configured to obtain, from the image captured by said camera, a position of a feature point of the panel recognition mark and a position of a feature point of the component recognition mark;

a calculation unit configured to calculate an amount of misalignment of the feature point of one of the panel recognition mark and the component recognition mark in the image from a predetermined position that is determined using the position of the feature point of the other one of the recognition marks as a reference;

a determination unit configured to determine whether or not the feature point of the panel recognition mark and the feature point of the component recognition mark are recognizable in the image; and

a correction unit configured to correct the image when said determination unit determines that the feature points are not recognizable,

wherein said obtaining unit is configured to obtain the positions of the feature points from either the image for which said determination unit has determined that the feature points are recognizable or the image corrected by said correction unit, and

when said determination unit determines that the feature points are not recognizable, said correction unit is configured to delete the conductive particles from the image and perform either linear interpolation or curve interpolation of a part of the image from which the conductive particles have been deleted.

4. A component mounting method performed by a component mounting system which includes:

a mounting apparatus which mounts a component on a panel; and

an inspection apparatus which detects an amount of misalignment, from a predetermined mounting position, of the component mounted on a surface of the panel through an adhesive which contains conductive particles,

said component mounting method being a method for correcting a mounting position of the component in the mounting apparatus based on the amount of misalignment, and comprising:

capturing, by a camera, an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component;

obtaining, from the image captured by the camera in said capturing, a position of a feature point of the panel recognition mark and a position of a feature point of the component recognition mark;

calculating an amount of misalignment of the feature point of one of the panel recognition mark and the component recognition mark in the image from a predetermined position that is determined using the position of the feature point of the other one of the recognition marks as a reference;

determining whether or not the feature point of the panel recognition mark and the feature point of the component recognition mark are recognizable in the image; and

correcting the image when it is determined in said determining that the feature points are not recognizable,

wherein in said obtaining, the positions of the feature points are obtained from either the image for which it has been determined in said determining that the feature points are recognizable or the image corrected in said correcting, and

in said correcting, the conductive particles are deleted from the image, and either linear interpolation or curve interpolation of a part of the image from which the conductive particles have been deleted is performed when it is determined in said determining that the feature points are not recognizable.