Composite sensor for detecting angular velocity and acceleration
View Patent ↗A composite sensor for detecting angular velocity and acceleration includes an angular velocity detecting element, an acceleration detecting element, an angular velocity signal processing IC, an acceleration signal processing IC, and a housing. The housing is formed of a multilayered circuit board and accommodates the angular velocity detecting element, the acceleration detecting element, the angular velocity signal processing IC, and the acceleration signal processing IC. The housing connects the angular velocity detecting element electrically to the angular velocity signal processing IC, and also connects the acceleration detecting element electrically to the acceleration signal processing IC.
1. A composite sensor comprising:
a first sensing element;
a second sensing element;
a first IC configured to process an output signal supplied from the first sensing element;
a second IC configured to process an output signal supplied from the second sensing element, and placed over the first IC; and
a package having a first electrode, a second electrode, and an inner bottom face, the package accommodating the first sensing element, the second sensing element, the first IC, and the second IC,
wherein the first electrode is directly connected to the first IC via a first conductor and the second electrode is directly connected to the second IC via a second conductor,
wherein the first electrode and the second electrode are disposed on the package,
wherein the second conductor is a metal wire which is separate from the package, and
wherein when viewed in a direction parallel to the inner bottom face of the package, a length of an upper side of a sectional shape of the second IC is shorter than a length of an upper side of a sectional shape of the first IC.
2. The composite sensor according to claim 1 , wherein
when viewed in a direction parallel to the inner bottom face of the package, each of the second IC and the first IC is without a hollow region.
3. The composite sensor according to claim 1 , wherein
a thickness of the second IC is smaller than a thickness of the first IC.
4. The composite sensor according to claim 1 , wherein
the second electrode has gold.
5. The composite sensor according to claim 1 , wherein
the first electrode has gold, and
the second electrode has gold.
6. The composite sensor according to claim 1 , wherein
the first sensing element is an angular velocity detecting element capable of detecting angular velocity, and
the second sensing element is an acceleration detecting element capable of detecting acceleration.
7. The composite sensor according to claim 1 , wherein
the first conductor is an electrode bump.
8. The composite sensor according to claim 1 , wherein
the first IC has an upper surface and a bottom surface,
the second IC has an upper surface and a bottom surface,
the bottom surface of the first IC has an electrode directly connected to the first electrode of the package via the first conductor,
the upper surface of the second IC has an electrode directly connected to the second electrode of the package via the second conductor.
9. The composite sensor according to claim 1 , further comprising an adhesive positioned between the first IC and the second IC.
10. The composite sensor according to claim 1 , wherein
the second electrode is positioned higher than the first electrode.
11. The composite sensor according to claim 1 , wherein
the second sensing element is located away from the first IC and the second IC.
12. The composite sensor according to claim 1 , wherein
the package has a substrate,
the substrate has a base on the substrate,
the substrate has the first electrode,
the base has the second electrode, and
the second electrode is positioned higher than the first electrode.
13. The composite sensor according to claim 1 , wherein
the package has a substrate,
the second sensing element is located on the substrate and positioned away from the first IC and the second IC.
14. The composite sensor according to claim 12 , wherein
the second electrode is positioned as high as the second IC.
15. The composite sensor according to claim 1 , wherein
the package has:
a first face accommodating the first sensing element, the second sensing element, the first IC, and the second IC,
a second face opposite to the first face, and
a power-supply electrode, a GND electrode, a first output electrode, and a second output electrode on the second face,
the power-supply electrode is connected to the first sensing element via the first IC, and connected to the second sensing element,
the GND electrode and the first output electrode are connected to the first sensing element, and
the second output electrode is connected to the second sensing element.
16. The composite sensor according to claim 1 , wherein
the package has layers of ceramic and the wiring conductor.
17. The composite sensor according to claim 1 , further comprising:
an underfill material provided on a surface of the first IC.
18. The composite sensor according to claim 1 , wherein
the package has a substrate,
the substrate, the first IC, and the second IC is stacked in this order, and
the second electrode is positioned higher than the first electrode.
19. The composite sensor according to claim 18 , comprising an adhesive positioned between the first IC and the second IC.
20. The composite sensor according to claim 18 , wherein
the package accommodating a housing and an electrical component.