IP Library Granted Patent US 7,979,982
Granted Patent B2
US 7,979,982 · App. 12/681,825 · Granted Jul 19, 2011

Imaging device, and method for manufacturing the same

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Quick Facts
Patent No.
US 7,979,982
App. No.
12/681,825
Granted
Jul 19, 2011
Kind
B2
Abstract

A vehicle-mounted camera ( 1 ) comprises a lower case ( 2 ) constituting a part of a case, an upper case ( 3 ) provided with lenses ( 3 a , 3 b ) constituting the case integrally with the lower case ( 2 ), an imaging element ( 4 ) for converting light passing through the lenses ( 3 a , 3 b ) into an electrical signal, an MID-mounting substrate ( 6 ) with the imaging element ( 4 ) mounted, substrate mounting bosses ( 3 c , 3 d ) for mounting the MID-mounting substrate ( 6 ) to the upper case ( 3 ), and spacers ( 7 a , 7 b ) interposed between the MID-mounting substrate ( 6 ) and the substrate mounting bosses ( 3 c , 3 d ) for adjusting the clearance between the lenses ( 3 a , 3 b ) and the light receiving plane of the imaging element ( 4 ), structured to fix the lower case ( 2 ) to the upper case ( 3 ) while the MID-mounting substrate ( 6 ) mounted with the imaging element ( 4 ) is being fixed to the upper case ( 3 ) by the substrate mounting bosses ( 3 c , 3 d ).

Claims (5)

1. A method for manufacturing an imaging device, comprising a second case holding a lens group composed of a plurality of lenses and constituting a body case integrally with a first case, an imaging element for converting an image obtained through said lens group into an electrical signal, and a circuit board with said imaging element mounted thereon, said second case having mounting means for fixing said circuit board thereto, comprising:

adjusting a clearance between said mounting means and said circuit board by moving said circuit board in a direction of an optical axis of said lens group to a position where said imaging element obtains an optimal image to measure said clearance;

interposing an adjustment member having a thickness based on said clearance measured at said position between said circuit board and said mounting means; and

fixing said circuit board onto said mounting means.

2. A method for manufacturing an imaging device as set forth in claim 1 , further comprising selecting said adjustment member based on said measuring from a plurality of adjustment members having different thicknesses prepared in advance.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2024
From: PANASONIC HOLDINGS CORPORATION
To: PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
Reel/Frame 066595/0839 →
CHANGE OF NAME Recorded Feb 21, 2024
From: PANASONIC CORPORATION
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 066644/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2010
From: INAGAKI, TATSUHIKO; IMAI, MAKOTO; MIMURA, HIDETOSHI
To: PANASONIC CORPORATION
Reel/Frame 024511/0310 →