Nonvolatile memory element, and nonvolatile semiconductor device using the nonvolatile memory element

1. A nonvolatile memory element comprising:

a first electrode;

a second electrode; and

a resistance variable layer which is disposed between the first electrode and the second electrode such that the resistance variable layer is in contact with the first electrode and the second electrode, the resistance variable layer having reversibly changeable resistances in response to electric signals with different polarities which are applied between the first electrode and the second electrode;

wherein the resistance variable layer comprises an oxygen-deficient tantalum oxide layer, the first electrode and the second electrode comprise materials which are made of different elements, and a standard electrode potential V 1 of the first electrode, a standard electrode potential V Ta of tantalum, and a standard electrode potential V 2 of the second electrode satisfy a relationship V 1 <V 2 and V Ta <V 2 .

2. The nonvolatile memory element according to claim 1 , wherein V 1 −V Ta which is a difference between the standard electrode potential V 1 of the material of the first electrode and the standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between-the standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship 0<V 1 −V Ta <V 2 −V Ta .

3. The nonvolatile memory element according to claim 1 , wherein V 1 −V Ta which is a difference between the standard electrode potential V 1 of the material of the first electrode and the standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between the standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship V 1 −V Ta ≦0<V 2 −V Ta .

4. The nonvolatile memory element according to claim 1 , wherein the first electrode comprises a material selected from a group consisting of W, Ni, Ta, Ti, Al, and Ta nitride, and the second electrode comprises a material selected from a group consisting of Pt, Ir, Pd, Ag and Cu.

5. The nonvolatile memory element according to claim 1 , wherein the first electrode comprises a material selected from a group consisting of Ta, Ti, and Al, and the second electrode comprises a material selected from a group consisting of Pt, Ir, Pd, Ag, Cu, W, Ni and Ta nitride.

6. The nonvolatile memory element according to claim 1 ,

wherein when a resistance value occurring when a positive voltage is applied to the second electrode on the basis of the first electrode is expressed as R 1 and a resistance value occurring when a negative voltage is applied to the second electrode on the basis of the first electrode is expressed as R 2 , the resistance value changes reversibly such that R 1 and R 2 satisfy R 1 >R 2 in a first mode;

wherein when a resistance value occurring when a negative voltage is applied to the second electrode on the basis of the first electrode is expressed as R 3 and a resistance value occurring when a positive voltage is applied to the second electrode on the basis of the first electrode is expressed as R 4 , the resistance value changes reversibly such that R 3 and R 4 satisfy R 3 >R 4 in a second mode; and

wherein R 1 /R 2 which is a ratio of R 1 to R 2 and R 3 /R 4 which is a ratio of R 3 to R 4 satisfy R 1 /R 2 >R 3 /R 4 .

7. The nonvolatile memory element according to claim 1 , wherein when the oxygen-deficient tantalum oxide layer is expressed as TaO x , 0.8≦x≦1.9 is satisfied.

8. The nonvolatile memory element according to claim 1 , wherein the oxygen-deficient tantalum oxide layer has, in a thickness direction thereof, a first region containing a first oxygen-deficient tantalum oxide and a second region containing a second oxygen-deficient tantalum oxide which is higher in oxygen content than the first oxygen-deficient tantalum oxide.

9. The nonvolatile memory element according to claim 8 , wherein the oxygen-deficient tantalum oxide layer includes at least a first oxygen-deficient tantalum oxide layer which is the first region and a second oxygen-deficient tantalum oxide layer which is the second region such that the first oxygen-deficient tantalum oxide layer and the second oxygen-deficient tantalum oxide layer are stacked together.

10. The nonvolatile memory element according to claim 9 , wherein the second oxygen-deficient tantalum oxide layer has a layer thickness which is not less than 1 nm and not more than 8 nm.

11. The nonvolatile memory element according to claim 8 , wherein the second electrode comprises a material having a standard electrode potential higher than the standard electrode potential of tantalum and a standard electrode potential of a material forming the first electrode, and the second region is positioned between the first region and the second electrode.

12. The nonvolatile memory element according to claim 8 , wherein when the first oxygen-deficient tantalum oxide is expressed as TaO x , 0.8≦x≦1.9 is satisfied.

13. The nonvolatile memory element according to claim 8 , wherein when the second oxygen-deficient tantalum oxide is expressed as TaO y , 2.1≦y<2.5 is satisfied.

14. The nonvolatile memory element according to claim 1 ,

wherein the oxygen-deficient tantalum oxide layer is in contact with the second electrode.

15. A nonvolatile semiconductor device comprising:

a semiconductor substrate; and

a memory array including plural first electrode wires provided on the semiconductor substrate to extend in parallel with each other; plural second electrode wires provided above the plural first electrode wires to extend in parallel with each other within a plane parallel to a main surface of the semiconductor substrate and to three-dimensionally cross the plural first electrode wires; and nonvolatile memory elements which are provided to respectively correspond to three-dimensional cross points between the plural first electrode wires and the plural second electrode wires;

wherein each of the nonvolatile memory elements includes a resistance variable layer disposed between a first electrode which is the first electrode wire and a second electrode which is the second electrode wire, a resistance value of the resistance variable layer being changeable reversibly in response to a voltage between the first electrode and the second electrode; and

wherein the resistance variable layer comprises an oxygen-deficient tantalum oxide layer, the first electrode and the second electrode comprise materials which are made of different elements, and a standard electrode potential V 1 of the first electrode, a standard electrode potential V Ta of tantalum, and a standard electrode potential V 2 of the second electrode satisfy a relationship V 1 <V 2 and V Ta <V 2 .

16. The nonvolatile semiconductor device according to claim 15 ,

wherein each of the nonvolatile memory elements includes a current controlling element between the first electrode and the second electrode;

and wherein the current controlling element is electrically connected to the resistance variable layer.

17. The nonvolatile semiconductor device according to claim 15 , comprising a multi-layer memory array in which plural layers of the memory array are stacked together.

18. A nonvolatile semiconductor device comprising:

a semiconductor substrate;

a logic circuit provided on the semiconductor substrate, for executing predetermined calculation; and

a nonvolatile memory element provided on the semiconductor substrate and having a programming function;

wherein the nonvolatile memory element includes a first electrode, a second electrode, and a resistance variable layer disposed between the first electrode and the second electrode, a resistance value of the resistance variable layer being changeable reversibly in response to a voltage between the first electrode and the second electrode; and

wherein the resistance variable layer comprises an oxygen-deficient tantalum oxide layer, the first electrode and the second electrode comprise materials which are made of different elements, and a standard electrode potential V 1 of the first electrode, a standard electrode potential V Ta of tantalum, and a standard electrode potential V 2 of the second electrode satisfy a relationship V 1 <V 2 and V Ta <V 2 .

19. The nonvolatile memory element according to claim 15 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship

0 <V 1 −V Ta <V 2 −V Ta .

20. The nonvolatile memory element according to claim 15 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship

V 1 ≦V Ta ≦0 <V 2 −V Ta .

21. A nonvolatile semiconductor device comprising:

a semiconductor substrate; and

a memory array including plural first electrode wires provided on the semiconductor substrate to extend in parallel with each other; plural second electrode wires provided above the plural first electrode wires to extend in parallel with each other within a plane parallel to a main surface of the semiconductor substrate and to three-dimensionally cross the plural first electrode wires; and nonvolatile memory elements which are provided to respectively correspond to three-dimensional cross points between the plural first electrode wires and the plural second electrode wires;

wherein each of the nonvolatile memory elements includes a first electrode connected to the first electrode wire, a second electrode connected to the second electrode wire, and a resistance variable layer disposed between the first electrode and the second electrode, a resistance value of the resistance variable layer being changeable reversibly in response to a voltage between the first electrode and the second electrode; and

wherein the resistance variable layer comprises an oxygen-deficient tantalum oxide layer, the first electrode and the second electrode comprise materials which are made of different elements, and a standard electrode potential V 1 of the first electrode, a standard electrode potential V Ta of tantalum, and a standard electrode potential V 2 of the second electrode satisfy a relationship V 1 <V 2 and V Ta <V 2 .

22. The nonvolatile semiconductor device according to claim 21 ,

wherein each of the nonvolatile memory elements includes a current controlling element between the first electrode and the second electrode;

and wherein the current controlling element is electrically connected to the resistance variable layer.

23. The nonvolatile semiconductor device according to claim 21 , comprising a multi-layer memory array in which plural layers of the memory array are stacked together.

24. The nonvolatile memory element according to claim 21 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship0<V 1 −V Ta <V 2 −V Ta .

25. The nonvolatile memory element according to claim 21 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship V 1 −V Ta ≦0<V 2 −V Ta .

26. A nonvolatile semiconductor device comprising:

a semiconductor substrate;

plural word lines and plural bit lines which are provided on the semiconductor substrate such that the plural word lines and the plural bit lines cross each other;

plural transistors provided to respectively correspond to cross points between the plural word lines and the plural bit lines; and

plural nonvolatile memory elements provided to respectively correspond to the plural transistors;

wherein each of the nonvolatile memory elements includes a first electrode, a second electrode, and a resistance variable layer disposed between the first electrode and the second electrode, a resistance value of the resistance variable layer being changeable reversibly in response to electric signals applied between the first electrode and the second electrode via an associated transistor;

and wherein the resistance variable layer comprises an oxygen-deficient tantalum oxide layer, the first electrode and the second electrode comprise materials which are made of different elements, and a standard electrode potential V 1 of the first electrode, a standard electrode potential V Ta of tantalum, and a standard electrode potential V 2 of the second electrode satisfy a relationship V 1 <V 2 and V Ta <V 2 .

27. The nonvolatile memory element according to claim 26 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship 0<V 1 −V Ta <V 2 −V Ta .

28. The nonvolatile memory element according to claim 26 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship V 1 −V Ta ≦0<V 2 −V Ta .

29. The nonvolatile semiconductor device according to claim 18 , further comprising the nonvolatile semiconductor device according to claim 15 .

30. The nonvolatile semiconductor device according to claim 29 , further comprising the nonvolatile semiconductor device according to claim 21 .

31. The nonvolatile semiconductor device according to claim 29 , further comprising the nonvolatile semiconductor device according to claim 26 .

32. The nonvolatile memory element according to claim 29 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship 0<V 1 −V Ta <V 2 −V Ta .

33. The nonvolatile memory element according to claim 29 , wherein V 1 −V Ta which is a difference between a standard electrode potential V 1 of the material of the first electrode and a standard electrode potential V Ta of tantalum and V 2 −V Ta which is a difference between a standard electrode potential V 2 of the material of the second electrode and the standard electrode potential V Ta of tantalum satisfy a relationship V 1 −V Ta ≦0<V 2 −V Ta .